Evatronix and LeCroy Host a Joint Webinar on SuperSpeed USB 3.0 Performance Validation
Update: Cadence Completes Acquisition of Evatronix IP Business (Jun 13, 2013)
Join LeCroy and Evatronix for a real-life engineering guide on the USB 3.0 standard and its hardware and software limitations.
February 24th 2011- Evatronix SA, the leading provider of the USB-IF certified solutions for SuperSpeed USB 3.0 IP, and LeCroy Corporation, a worldwide leader in serial data test solutions have announced today the joint webinar on the key USB 3.0 feature – the actual performance of the highly popular standard. Since the main driver for development of the SuperSpeed USB interface was the significant increase of the theoretical data transfer speed – from 480 Mbps to 5 Gbps, both companies will leverage on their expertise and explain step by step how the different hardware and software layers affect the data transfer speed while providing actual measures.
The webinar will be focused on hardware and software overhead of the USB 3.0 interface and methods for proper data transfer speed validation. The practical example of a USB Mass Storage UAS application will be used to explain the impact of each of the USB layers on the performance of the interface, while the applied validation methodology will provide proper system evaluation.
“Now that we see more and more USB 3.0 applications in development, it is essential to provide designers with knowledge of what they can expect of this standard,” said Dariusz Kaczmarczyk, USB Product Line Manager at Evatronix. “Our webinar will not only list the important issues users will face when designing their systems, but also provide highly credible data confirmed by close cooperation between Evatronix and LeCroy.”
“We are pleased to collaborate with Evatronix to help educate the USB 3.0 market and accelerate the deployment of commercial products," said Roy Chestnut, Product Line Manager at LeCroy’s Protocol Solutions Group. "Working directly with Evatronix has allowed LeCroy engineers to collect valuable insight into the verification challenges faced by developers working on USB Attached SCSI (UAS) devices and software.”
WEBINAR DATES
The webinar will take place on March 3rd, 2011 at 14.30 CET, and be repeated on March 16th, 2011 at the same time. Please register at bit.ly/gdM6rD for the early March date and use bit.ly/eLF1u3 for the mid-month term.
ABOUT EVATRONIX
Evatronix SA, founded in 1991, develops electronic virtual components (IP cores) with complementary software and supporting development environments. The company also provides electronic design services. Evatronix is a renowned provider of 8051 microcontrollers, SuperSpeed USB 3.0 and USB 2.0 controllers and memory controllers including ONFi 2.2 compatible NAND Flash and SD 3.0/SDIO 2.0 and eMMC 4.4 compatible SDIO Host controllers. Evatronix is headquartered in Bielsko-Biala, Poland, and employs over 75 engineers.
For more information please visit the company’s web site at www.evatronix.com/ip
ABOUT LECROY CORPORATION
LeCroy Corporation is a worldwide leader in serial data test solutions, creating advanced instruments that drive product innovation by quickly measuring, analyzing, and verifying complex electronic signals. The Company offers high-performance oscilloscopes, serial data analyzers, and global communications protocol test solutions used by design engineers in the computer and semiconductor, data storage device, automotive and industrial, and military and aerospace markets. LeCroy’s 45-year heritage of technical innovation is the foundation for its recognized leadership in “WaveShape Analysis”—capturing, viewing, and measuring the high-speed signals that drive today's information and communications technologies. LeCroy is headquartered in Chestnut Ridge, New York.
Company information is available at www.lecroy.com
|
Related News
- Evatronix and LeCroy Announce Partnership for SuperSpeed USB 3.0 Development Solutions
- SuperSpeed USB (USB 3.0) Performance to Double with New Capabilities
- Evatronix and M31 Tech Introduce a USB-IF Certified Complete SuperSpeed USB 3.0 IP Solution
- Evatronix Announces the USB 3.0 Compatible High Speed Hub IP Core with Analog and Digital PHY Options
- PLDA USB 3.0 IP Reaches Key Milestone with 100th Design Win
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |