ST's Bozotti cheers for European chips
Peter Clarke, EETimes
2/28/2011 12:31 PM EST
GRENOBLE, France – Carlo Bozotti, president and chief executive officer of STMicroelectronics, provided a keynote address to the Industry Strategy Symposium (ISS Europe) held here by industry body SEMI, which contained a commitment to European chip making – but only just.
Rather than sounding three-cheers, Bozotti outlined European chipmaking as one leg of a three-legged manufacturing strategy at Europe's leading indigenous chip company.
E-mail This Article | Printer-Friendly Page |
Related News
- Bozotti has a dream: to turn round ST's digital problem
- SanDisk Files Multiple Actions Against STMicroelectronics; Actions Seek to Stop Sale of ST's NAND Chips and Invalidate ST Patents
- ST's Bozotti on 'back-to-silicon' differentiation
- Report: ST sees chip market likely at bottom
- Chips&Media to Exhibit at the 1'st TSMC OIP Ecosystem Forum
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards