Alvand Technologies Announces Advanced Wireless MIMO Analog Front End Platform for LTE/WiMAX Application
Santa Clara California, March 03, 2011:- Alvand Technologies, a leading provider of Analog and Mixed-Signal IP cores, today announced the availability of silicon-proven wireless MIMO analog front-end for LTE/WiMAX, and Wi-Fi applications in 65nm.
The ALVWAFE12-80M65UA is a low power, ultra compact wireless AFE designed in standard UMC 65 nm process. It consists of two 12-bit IQ ADC cores, two 12-bit current-steering IQ DAC cores, one 10-bit auxiliary ADC, one 10-bit auxiliary DAC and a low jitter PLL. It consumes only 150 mW at 80 MSPS operation and has an ultra-small core area.
“We are very happy to be one of the leaders in wireless MIMO AFE IP market. These high-performance, ultra low power IPs are important to enable our customers to achieve new milestones.” said Syed S. Islam, Director Mixed-Signal IP / ASIC. “This silicon-proven IP adds to our existing portfolio of multiple AFE IPs, of which many of them are in mass production.”
About Alvand Technologies, Inc.:
Alvand Technologies is a leading analog IC design company that specializes in high-speed, low-power, and ultra small die area data converters (ADC/DAC) and Analog Front End (AFE) for a broad range of applications, such as wireless (Wi-Fi, WiMAX, LTE) systems, ultrasound and mobile TV. Alvand also provides full turnkey mixed-signal ASICs based on its high performance and low power IPs. For more information visit us at http://www.alvandtech.com
|
Related News
- Alvand Technologies Announce tape-out of its compact, low-power Wireless MIMO Analog Front End in 40nm
- Faraday Selects Alvand Technologies AFE (Analog Front End) IP to Support Next Generation Wireless Applications
- Alvand Technologies Offers Analog Mixed-Signal IP in 28nm Process
- Alvand Collaborates with GLOBALFOUNDRIES to Provide Analog Mixed-Signal IP for Wireless MIMO Applications
- IQ-Analog now offers low power, size efficient wideband Analog Front End for (AFE) for WiMAX, Digital Video Broadcast and 802.11x applications
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |