SMS Business Momentum Adds to eSilicon's Revenue Growth
Newest customer, Ozmo Devices, selects eSilicon SMS to support fast ramp to production
SUNNYVALE, Calif. — March 10, 2011 — eSilicon Corporation, the largest independent semiconductor Value Chain Producer (VCP), today announced that Ozmo Inc., a leading provider of low-power Wi-Fi PAN products, will produce its chips through eSilicon’s Semiconductor Manufacturing Services (SMS) business unit. SMS delivers a turnkey service for products already in the manufacturing phase by ramping up in volume and managing the products through their entire lifecycle. The turnkey service includes quality and product cost management, capacity and delivery scheduling and supply chain management.
Launched in 2010, eSilicon’s SMS business unit provides high-value manufacturing services through a combination of a broad base of proven supply chain partners, an enterprise-wide infrastructure for resource planning and the eSilicon Access® work-in-process (WIP) tracking solution with automated schedule impact analysis. Through SMS, customers can divest themselves of internal, backend engineering and supply chain management activities and focus on market differentiation activities.
“We addressed Ozmo’s need for a proven, high-value, cost-effective manufacturing services partner. Our systems, processes, operations experts and amortized cost model provide for world-class operations capability while delivering enhanced customer satisfaction. By utilizing SMS turnkey services, Ozmo can focus on product development and customer service while creating a flexible manufacturing system that can easily adjust according to product cycles,” said Lawrence Conrad, vice president and general manager of the SMS business unit. “Since forming the business unit last year, eSilicon has signed up sevencustomers and expects significant SMS revenue growth for fiscal year 2011.”
“In order to maintain our fast growth and enviable market edge, while simultaneously ramping to meet customer demands, we are offloading our silicon manufacturing operations to eSilicon” said Bill McLean, CEO of Ozmo Inc. “We believe eSilicon can provide us with the high quality manufacturing services that will allow us to easily ramp to meet any production levels.”
About Value Chain Producers
A Value Chain Producer (VCP) is a company that collaborates with foundries, IP and service providers, EDA suppliers, package, assembly and test operations in designing and producing chips for fabless IC, IDM and OEM companies. VCPs optimize the economics of customer value chains and enable customers to focus on their product differentiation and market growth. A VCP earns revenue by shipping packaged, tested products with the customer’s logo. The term was created by eSilicon and was adopted by the Global Semiconductor Alliance (GSA) as a new category in October 2009.
About eSilicon
eSilicon, the largest independent semiconductor Value Chain Producer (VCP), delivers ASICs to OEM and fabless semiconductor companies through a flexible, lower-risk path to volume production by deploying its comprehensive suite of design through manufacturing services.
The company’s customers include system original equipment manufacturers (OEMs) and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments. eSilicon — Enabling Your Silicon Success™. For more information, please visit www.esilicon.com.
About Ozmo Devices
Ozmo Devices is the leading provider of low-power Wi-Fi PAN solutions. Ozmo Devices extends the functionality of Wi-Fi-enabled platforms to seamlessly communicate with peripherals. Ozmo Devices’ silicon solution delivers superior performance for low-power wireless peripherals like mice and headsets. Ozmo Devices is backed by top-tier venture capital firms and managed by semiconductor industry veterans. The company is headquartered in Palo Alto, California, and has offices in the United Kingdom. For more information about Ozmo Devices, visit www.ozmodevices.com.
|
Related News
- eSilicon names Lawrence Conrad as general manager of Semiconductor Manufacturing Services business unit
- eMemory's eNVM SIP NeoFuse Contributes to Revenue Growth Momentum
- Apple's Shift in Chip Manufacturing Strategy Boosts Semiconductor Foundry Business in 2013
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- NEDO Approves Rapidus' FY2024 Plan and Budget for "Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration"
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |