Recore Systems' Xentium DSP central to many-core demo at DATE2011
GRENOBLE, - March 15, 2011 - Recore Systems puts a real-life application of its Xentium® VLIW DSP IP core on demonstration at DATE2011. Xentium plays a central role in a radically scalable platform chip developed by the CRISP consortium, on which many Xentium cores in parallel perform the digital signal processing subtasks for various streaming applications.
“We are excited to show the value of the Xentium IP core in the practical application of a highly scalable many-core platform”, says Gerard Rauwerda, CTO at Recore Systems. The CRISP project accomplished a heterogeneous many-core system with a General Purpose Processor, 45 Xentium DSP cores, and 10 smart memory tiles. Rauwerda continues: “Xentium’s processing power, which can measure up against any common DSP core, comes with a small silicon footprint and targets embedded low power applications. This makes the Xentium an excellent choice for general streaming applications such as satellite navigation or digital beamforming. The CRISP consortium chose Xentium also because it is easy to use in scalable many-cores. We foresee a wide range of commercial streaming applications benefiting from the Xentium IP.”
The CRISP consortium (Cutting edge Reconfigurable ICs for Stream Processing) develops a single, highly scalable, reconfigurable platform that can be used for a wide range of streaming applications. Professor Jari Nurmi, Tampere University of Technology: “Recore Systems’ Xentium core and smart memory tiles were central to the design of the scalable and reconfigurable many-core platform. We’ve implemented a global satellite navigation application as low-end consumer example and digital beamforming as high-end professional example, to show the scalability of the concept and design methodology. We used 5 to 39 Xentium cores in parallel depending on the application.”
About Recore Systems:
Recore Systems is a fabless semiconductor company that develops advanced digital signal processing platform chips and licenses reconfigurable semiconductor IP. The company is specialized in reconfigurable multi-core designs that allow instant adaptation to new situations and offer a unique combination of flexibility, high performance, low power and low cost. Reconfigurable systems reduce time-to-market and offer flexibility through software upgrades.
The scalable multi-core technology is applied both in ultra energy-efficient portable consumer electronics and in computational demanding high-end applications. Typical application areas are broadcasting, wireless (tele)communications, multimedia and digital beamforming.
Recore's reconfigurable technology comprises innovative processor cores, design tools for easy integration in customer solutions and ready-to-use applications. Besides reconfigurable hardware solutions, Recore provides accompanying IDE tools, software libraries and application engineering services.
For more information, please visit www.recoresystems.com
About CRISP:
The CRISP Consortium (Cutting edge Reconfigurable ICs for Stream Processing) consists of Recore Systems (Coordinator), University of Twente, Atmel Automotive, Thales Netherlands, Tampere University of Technology, and NXP Semiconductors. The CRISP consortium is supported by the European Union under the Seventh Framework Programme (FP7). www.crisp-project.eu
|
Related News
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
- Cadence and Dolby Collaborate to Enable the World's First TVs Featuring Dolby Atmos Technology
- Many-core processor IP company Recore Systems secures $2 million Series B investment for go-to-market
- Recore Systems releases a many-core processor subsystem IP-on-FPGA
- Cadence Offers Industry's First IP Core Solution Supporting DTS Neural Surround
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |