FUJIFILM Microdevices clicks on Tensilica(R) Technology

February 7, 2002, Santa Clara, California and Yokohama, Japan -- FUJIFILM Microdevices Co. Ltd., the research and development subsidiary of Fuji Photo Film Co., Ltd., has licensed Tensilica's Xtensa technology for the development of a system-on-chip (SOC) that will be incorporated into future digital still cameras (DSC). The agreement marks Tensilica's first publicly announced design win in the digital camera field.

"Low cost and power are the key concerns for today's boom in hand-held electronic systems," stated Bernie Rosenthal, Tensilica's senior vice president of marketing and business development. "By exploiting the configurability and extensibility of the Xtensa architecture, FUJIFILM Microdevices will realize significant power savings without compromising the system's sophistication or time-to-market considerations.

Mr. Kazuyuki Masukane, Director VLSI Design Department of FUJIFILM Microdevices, said, "We have been impressed by Xtensa's revolutionary technology, and we are looking forward to harnessing this methodology to realize SOC designs for our next generation digital cameras."

About FUJIFILM Microdevices
FUJIFILM Microdevices Co. Ltd. is a subsidiary of Fuji Photo Film Co., Ltd. of Tokyo (FUJIY), a leading global manufacturer of imaging and information products for electronic imaging system. FUJIFILM Microdevices employs 255 people, and is located at 1-6, Matsusakadaira, Taiwa-Cho, Kurokawa-Gun, Miyagi, 981-3493 Japan. (Tel.: +81-22-347-1111, FAX: +81-22-347-1120, url: www.fujifilm.co.jp/ffm).

About Tensilica
Tensilica was founded in July 1997 to address the fast-growing market for configurable processors and software development tools for high volume, embedded systems. Using the company's proprietary Xtensa Processor Generator, system-on-chip (SOC) designers can develop a processor subsystem hardware design and a complete software development tool environment tailored to their specific requirements in hours. Tensilica's solutions provide a proven, easy-to-use, methodology that enables designers to achieve optimum application performance in minimum design time. The Company has over 140 engineers engaged in research, development, and customer support from its offices in Santa Clara, California; Burlington, Massachusetts; Princeton, NJ; Austin, Texas; Raleigh, NC; Oxford, U.K.; Stockholm, Sweden; Taipei, Taiwan, R.O.C.; and Yokohama, Japan. Tensilica is headquartered in Santa Clara, California (95054) at 3255-6 Scott Boulevard, and can be reached at (408) 986-8000 or via www.tensilica.com on the World Wide Web.

Editors Notes:
o "Tensilica" and "Xtensa" are registered trademarks belonging to Tensilica Inc.
o Tensilica's announced licensees are Avision, Berkeley Wireless Research Center, Broadcom, Cisco Systems, Conexant Systems, FUJIFILM Microdevices, Fujitsu Ltd., Hughes Network Systems, Ikanos Communications, JNI Corporation, Marvell (Galileo Technology), Mindspeed Technologies, National Semiconductor, NEC Networks, NEC Solutions, Nippon Telephone and Telegraph (NTT), ONEX Communications

Contacts:

Tensilica, Inc.
Kim Alfaro
(408)-327-7343
kim@tensilica.com

Tensilica, Inc.
Joany Draeger, Tanis Communications
(650)-365-3395
joany@taniscomm.com

Tensilica KK
Masumi Takahashi
045-477-3373
mastaka@tensilica.com