MOSAID and Hynix Sign Memorandum of Understanding
OTTAWA, Ontario - March 31, 2011 - MOSAID Technologies Inc. (TSX:MSD) today announced that it has signed a Memorandum of Understanding (MOU) with Hynix Semiconductor Inc. (Hynix) of Korea. The MOU calls for Hynix to take a six-year license to MOSAID's patents, with fixed equal quarterly payments over the term. The parties expect a final definitive agreement to be signed within the next few weeks. Hynix's existing patent license agreement with MOSAID expires on March 31, 2011.
"We are extremely pleased to have reached agreement with Hynix," said John Lindgren, President and CEO, MOSAID. "This makes MOSAID five-for-five for renewing term licenses without any lapse in coverage and is a testament to the continuing strength and value of our memory patents," said Lindgren.
About MOSAID
MOSAID Technologies Inc. is one of the world's leading intellectual property companies. MOSAID develops semiconductor memory technology and licenses patented intellectual property in the areas of semiconductors and communications systems. MOSAID counts many of the world's largest technology companies among its licensees. Founded in 1975, MOSAID is based in Ottawa, Ontario. For more information, visit www.mosaid.com and http://investorchannel.mosaid.com
|
Related News
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Renesas Announces Termination of Memorandum of Understanding and Tender Offer for Proposed Acquisition of Sequans
- ADTechnology and CoSignOn/CoreLink Sign MOU to Further Collaborate on High-Bandwidth Memory for Next-Generation HPC
- Tachyum Signs Memorandum of Understanding with MatLogica
- CXL™ Consortium and JEDEC® Sign MOU Agreement to Advance DRAM and Persistent Memory Technology
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |