Sidense Completes TSMC IP9000 Assessment for Non-Volatile Memory (NVM) Product Families
Update: Synopsys Expands DesignWare IP Portfolio with Acquisition of Sidense Corporation (Oct. 17, 2017)
Sidense SLP and ULP one-time programmable (OTP) memory macros meet all of TSMC's IP9000 Assessment requirements
Ottawa, Canada - (April 5, 2011) - Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) one-time programmable (OTP) memory IP cores, announced today that the Company's SLP and ULP OTP product families have met the Assessment requirements of TSMC's rigorous IP9000 program.
Sidense has many customers license their OTP macros at several process nodes and node variants, ranging from 180nm to 40nm. Completion of IP9000 Assessment of the 180nm SLP and ULP products represent only a small portion of the IP9000 evaluations Sidense products are currently undergoing; several more products at various process nodes are scheduled for the IP9000 Assessment evaluation later this year.
TSMC developed the rigorous IP9000 program to establish a set of requirements in order to assure the consistency, completeness and quality of IP provided by TSMC's IP partners. It includes a multi-tiered process starting with the IP design and ultimately culminating in monitoring of yield during volume production to ensure the IP's continued manufacturability. The IP9000 Assessment includes complete characterization of the IP over process, voltage, and temperature and full three-lot qualification. Passing this milestone demonstrates the IP's readiness for volume manufacturing.
"Passing IP9000 acceptance criteria is recognized within the semiconductor IP industry as a demonstration of very high IP quality," said Rhéal Gervais, Vice President of Operations at Sidense. "Meeting IP9000 Assessment gives our customers who use TSMC's foundry services confidence that our 1T-Fuse™-based SLP and ULP OTP will meet their quality requirements."
"We are pleased that these Sidense non-volatile memory IP products have passed TSMC's IP9000 Assessment requirements," said Dan Kochpatcharin, Deputy Director of IP Portfolio Marketing at TSMC. "During our IP9000 audit this past November, we found Sidense to be very well-prepared in terms of both QC and design methodology."
About SLP and ULP
SLP is a smaller, lower power version of Sidense's SiPROM product family with a maximum macro size of 256 Kbits. Initially manufactured at 180nm, SLP macros target cost- and power-sensitive applications such as handheld communication devices, chip and product IDs, analog trimming and calibration, and code storage. Sidense developed ULP as field-programmable eFuse replacements for precision analog trimming and calibration applications. Initially manufactured at 180nm, ULP macros are available from 16 bits to 2 Kbits and feature low power, low read voltage and fast start-up times.
About Sidense Corp.
Sidense Corp. provides secure, very dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes with no additional masks or process steps required and no impact on product yield. The Company's innovative one-transistor 1T-Fuse™ architecture provides the industry's smallest footprint, most reliable and lowest power Logic Non-Volatile Memory (NVM) IP solution. With over 70 patents granted or pending, Sidense OTP provides a field-programmable alternative solution to Flash, mask ROM and eFuse in many OTP and MTP applications.
Sidense SiPROM, SLP and ULP memory products, embedded in over 150 customer designs, are available from 180nm down to 40nm and are scalable to 28nm and below. The IP is offered at and has been adopted by all top-tier semiconductor foundries and selected IDMs. Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, WHDI, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, please visit www.sidense.com.
|
Related News
- Sidense Completes TSMC IP9000 Assessment for SiPROM NVM IP and Attains more than 70 Customer Licenses in the Last 12 Months
- Sidense's NVM IP Completes TSMC IP9000 Assessment at 90nm Low-Power Process Node
- Kilopass' XPM Antifuse Embedded Non-Volatile Memory IP Successfully Completes TSMC9000 Qualification for TSMC 55nm HV Process
- Kilopass First to Offer Logic Non-Volatile Memory (NVM) in TSMC 40nm and 45nm Low-Power (LP) Processes
- Virage Logic Offers Broadest Portfolio of Embedded Non-Volatile Memory (NVM) Solutions at TSMC
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |