TSMC rolls smartphone/tablet process
Mark LaPedus, EETimes
4/5/2011 5:53 PM EDT
SAN JOSE, Calif. – During the TSMC 2011 Technology Symposium here, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) rolled out what could be the industry’s first manufacturing process optimized for chips used in smartphones and tablets.
The technology is a new member of its 28-nm process offerings. Called 28HPM or high-performance mobile, the process is tuned for smartphones, tablets and related products, said Shang-Yi Chiang, senior vice president of R&D at TSMC.
E-mail This Article | Printer-Friendly Page |
|
Related News
- TSMC drives A16, 3D process technology
- M31 Launches USB4 IP for TSMC 5nm Process
- QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time
- M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process
- eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models