Why is TSMC moving into 450-mm?
Mark LaPedus, EETimes
4/6/2011 3:00 PM EDT
SAN JOSE, Calif. – During the TSMC 2011 Technology Symposium here on Tuesday (April 5), Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) provided more details about its efforts in the 450-mm arena.
As reported, TSMC is moving full speed ahead into the 450-mm fab era. The move is intended to reduce production costs and stay one step ahead of its rivals, such as Globalfoundries, Samsung, UMC and others.
E-mail This Article | Printer-Friendly Page |
|
Related News
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards