Intel designs smartphone, says report
EETimes (4/11/2011 1:48 PM EDT)
SAN FRANCISCO—Intel Corp. has designed a cellular handset that could be manufactured by China's ZTE Corp., according to a report by the Bloomberg news service that cites two anonymous sources.
Intel has supplied a design for the handset based on a version of its Atom microprocessor that may go on sale in China, according to the report.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Intel to place US$14 billion orders with TSMC, says report
- Lip-Bu Tan quit Intel board after "differences" with CEO, says Reuters
- Source Photonics Licenses 800G Transceiver Module Designs from Intel
- China's EDA startup X-Epic forced to lay off staff, says report
- Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards