Dini Group Selected by Cadence to supply high-capacity FPGA-boards
June 7, 2011 -- FPGA-based prototyping solutions are widely used as a platform for early, pre-silicon software development, and the Dini Group has been serving this market for many years. Flexibility, reliability, capacity and performance are key user requirements for FPGA-based prototyping boards and the Dini boards have the reputation of providing just that. Cadence Design Systems has chosen FPGA-boards from the Dini Group to be integrated into the recently announced Cadence Rapid Prototyping Platform. The Cadence Rapid Prototyping Platform, as part of the Cadence System Development Suite, enables fast prototype bring-up, advanced debug capabilities and compatibility with the Cadence Palladium XP Verification Computing Platform.
“We are utilizing the Dini Group’s vast experience with high-capacity FPGA boards for providing high-quality FPGA boards as part of our new Cadence Rapid Prototyping Platform,” says Juergen Jaeger, Sr. Product Marketing Manager for System Realization at Cadence. “Our multi-FPGA partitioning and implementation software, combined with the Dini boards, enables the fastest FPGA-based prototyping bring-up in the industry, allowing our customers to start embedded software development as early as possible and meet challenging time-to-market requirements.”
Cadence has selected a variation of the Altera-based Dini boards as the hardware platform, providing capacities of up to 30M ASIC gates. These boards feature the largest Stratix 4 FPGAs enabling the user to realize high-capacity and high-performance prototype configurations. The boards feature a wide range of I/O options and are well suited to prototype complex SoC designs in a reliable and affordable solution. The boards are tightly integrated into the Cadence Rapid Prototyping Platform with its innovative integrated compile engine that allows designs to be fully automatically partitioned and mapped into multiple FPGAs, while preserving functionality and compatibility with the rest of the Cadence System Development Suite.
“We are very pleased that Cadence selected our boards for their Rapid Prototyping Platform,” said Mike Dini, President. “Their users will find our large selection of daughterboard and SODIMM card options to be very useful, and we will offer our unmatched customer service to support them. Our product quality will exceed their expectations.”
About Dini Group
The Dini Group was established in 1995 as a consulting company. While developing ASICs for various clients they saw the need for cost effective logic emulation platforms and developed several of them. In 1998 they started selling these platforms to ASIC developers and FPGA system users. From their offices in La Jolla, Dini Group employees have supplied over ten billion ASIC gates. The Dini Group corporate headquarters is located at 7469 Draper Ave., La Jolla, CA 92037-5026, phone: (858) 454-3419. On the Web at: www.dinigroup.com.
|
Related News
- S3 Group Selected to Power New Generation of Iridium Communications Devices
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program
- AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions
- Imagination GPU selected by StarFive for next-generation VisionFive 2 single-board computer
- "Onshoring" chip production is a red herring: the UK should double down on its competitive advantage in R&D and IP to create a secure semiconductor supply chain
Breaking News
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
Most Popular
E-mail This Article | Printer-Friendly Page |