Brite Semiconductor Achieves First-Pass Silicon Success with SMIC's 40nm Process
SHANGHAI, June 21, 2011 -- Brite Semiconductor (Shanghai) Corporation and Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 0981.HK) today announced that they have achieved first-pass silicon success with Brite's first 40nm chip, using SMIC's 40nm process technology.
Brite Semiconductor's independently designed 40nm chip is the result of Brite's collaboration with Synopsys Inc. and SMIC. It integrates Synopsys' DesignWare® embedded memory and standard cell libraries, and SMIC's independently developed PLL and I/O IP. The successful implementation of the design has proven Brite's front-end and back-end design flows on 40nm advanced technology.
"The expertise of Brite's design team and its rigorous design methodology have resulted in the first-pass silicon success of our 40nm chip. This marks a key milestone for Brite Semiconductor, and further establishes Brite as a premier global design service company," said Dr. Charlie Zhi, CEO of Brite Semiconductor.
"The collaboration between Synopsys and Brite demonstrates our commitment to serve our customers with solutions that accelerate design tape-out. The first-pass silicon success of Brite's first 40nm design validates Synopsys' reference design flow on SMIC's 40nm advanced technology, and reflects the strong capability of Brite's design team," said Robert Li, General Manager of Synopsys China.
"We are pleased to see that our collaboration with Brite and Synopsys has achieved first-pass silicon success on SMIC's 40nm advanced technology. This joint effort demonstrates the capability of SMIC's 40nm advanced technology to effectively support leading-edge designs. We are confident that Brite will continue to forge close partnerships with its customers and quickly ramp into production," said Chris Chi, Senior Vice President and Chief Business Officer of SMIC.
About Brite Semiconductor
Brite Semiconductor is a fabless ASIC turnkey service company delivering the most cost-effective, predictable and reliable custom ASIC solutions to electronics product customers worldwide. With SMIC and Open-Silicon as strategic partners, Brite Semiconductor uses proven design flows and methodologies with advanced design capability, and provides end-to-end custom ASIC solutions based on a proven business model that provides a seamless, low-cost, low-risk alternative to traditional models for complex ASIC design and development. For more information, please visit www.britesemi.com.
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is a world leader in electronic design automation (EDA), supplying the global electronics market with the software, intellectual property (IP) and services used in semiconductor design, verification and manufacturing. Synopsys' comprehensive, integrated portfolio of implementation, verification, IP, manufacturing and field-programmable gate array (FPGA) solutions helps address the key challenges designers and manufacturers face today, such as power and yield management, system-to-silicon verification and time-to-results. These technology-leading solutions help give Synopsys customers a competitive edge in bringing the best products to market quickly while reducing costs and schedule risk. Synopsys is headquartered in Mountain View, California, and has approximately 70 offices located throughout North America, Europe, Japan, Asia and India. Visit Synopsys online at http://www.synopsys.com/.
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 45/40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, and a 200mm fab under construction in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation. For more information, please visit www.smics.com
|
SMIC Hot IP
Related News
- Synopsys' DesignWare Audio IP Achieves First-Pass Silicon Success in Leading 65-nm and 55-nm Process Technologies
- Tenstorrent Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using Synopsys' Broad DesignWare IP Portfolio
- Nitero Achieves First-Pass Silicon Success for Industry's First Mobile 60GHz SoC Using Synopsys DesignWare IP for PCI Express and Tools
- Picochip Achieves First Silicon Success for 40-nm picoXcel Femtocell Chip Using Synopsys' Lynx Design System
- Fairchild Semiconductor Achieves First-Pass Silicon Success with DesignWare USB 2.0 nanoPHY IP
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |