Semicon keynoter urges new biz models
Dylan McGrath, EETimes
7/13/2011 2:30 AM EDT
SAN FRANCISCO—The semiconductor industry is 53 years old, accounts for 0.6 percent of worldwide GDP, and should account for more in years to come, according to Tien Wu, chief operating officer of test and packaging provider ASE Inc., and a keynoter at the 2011 Semicon West fab vendor tool trade show here.
Wu described two types of successful companies—"opening door" companies, which promote innovation by pushing many technologies, some of which ultimately succeed, and "closing door" companies, which promote fewer technologies and succeed by building scale, efficiency, entry barriers, and evolving standards with limited investment.
E-mail This Article | Printer-Friendly Page |
Related News
- TSMC keynoter touts cooperative business models
- Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications
- Linux Foundation Welcomes the Open Model Initiative to Promote Openly Licensed AI Models
- AMD Completes Acquisition of Silo AI to Accelerate Development and Deployment of AI Models on AMD Hardware
- Fractile raises $15m seed funding to develop radical new AI chip and unlock exponential performance improvements from frontier AI models
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards