English
5V Library for Generic I/O and ESD Applications TSMC 12NM FFC/FFC+
Intel SoCs aided by interconnect, IP library
Peter Clarke, EETimes
7/26/2011 7:04 AM EDT
LONDON – Intel now has the tools in place – in particular an on-chip interconnect fabric, an extensive IP library and software – to make a success of its system-on-chip engineering effort, according to Bill Leszinske, general manager of technical planning and business development at Intel's Atom processor SoC development group.
Intel has been striving to break out of the computer sector for many years and its system-on-chip engineering group is a key part of that effort.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs
- Rambus Joins the Intel Foundry Services (IFS) Accelerator IP Alliance to Enable State-of-the-Art SoCs
- PLDA Announces Robust Verification Toolset, Increasing Design Accuracy and Reducing Time-to-Production for Next Generation SoCs with CXL, PCIe 6.0 or Gen-Z Interconnect
- Arteris IP FlexNoC Interconnect Licensed by Picocom for 5G New Radio Infrastructure Baseband SoCs
- Horizon Robotics Licenses NetSpeed Interconnect IP for AI SoCs
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks