180nm OTP Non Volatile Memory for Standard CMOS Logic Process
GLOBALFOUNDRIES Offers BCDlite Technology Process for Applications in the Automotive Industry
Modular and reliable process platform enables simplicity, flexibility, cost and performance optimization
Milpitas, Calif., September 12, 2011 – GLOBALFOUNDRIES today announced it is offering its BCDlite™ foundry technology optimized for automotive applications such as power management devices, audio amplifiers, displays and LED driver integrated circuits (ICs). Built on a proven process used in high-volume manufacturing for consumer applications, the 0.18um technology is a comprehensive, modular platform that offers an unprecedented combination of performance and cost.
According to a report by Semicast Research, the average semiconductor content per vehicle is expected to grow at CAGR 4.3% from 2008 to 2017, approximately $425 per vehicle by 2017. The overall global revenue for automotive semiconductor market is forecasted to grow from US$20 billion in 2010 to US$39 billion by 2017.
“As we continue to see an increasing trend of manufacturers integrating more electronic components into automobiles, GLOBALFOUNDRIES is well positioned to support the automotive industry with our foundry expertise, “said Raj Kumar, Senior Vice President for GLOBALFOUNDRIES’ 200mm Business Unit and General Manager for Singapore. “Today’s announcement further validates the comprehensive set of automotive-qualified processes we offer to the market.”
The 0.18um BCDlite™ platform features competitive Rdson in a less complex process while providing extensive device characterization, modeling, ESD and PDK support. Additionally, embedded OTP non-volatile memory is available as an option.
To ensure robustness in its automotive process manufacturing, the GLOBALFOUNDRIES’ 0.18um BCDlite™ has undergone the Automotive Electronic Council’s AEC-Q100 Group D critical reliability test. In addition, the company also conducted its own stringent quality and reliability assessments on the process solution to complement the industry standard. The AEC-Q100 qualified 0.18um BCDlite™ solution will be offered to customers in Q4, 2011.
All GLOBALFOUNDRIES’ 200mm fabs in Singapore are certified to ISO/TS16949 automotive quality standards. The company today serves six of the top 10 automotive semiconductor suppliers in the world and has also achieved qualification by many key automotive system manufacturers.
ABOUT GLOBALFOUNDRIES
GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global manufacturing and technology footprint. Launched in March 2009 through a partnership between AMD [NYSE: AMD] and the Advanced Technology Investment Company (ATIC), GLOBALFOUNDRIES provides a unique combination of advanced technology, manufacturing excellence and global operations. With the integration of Chartered Semiconductor in January 2010, GLOBALFOUNDRIES significantly expanded its capacity and ability to provide best-in-class foundry services from mainstream to the leading edge. GLOBALFOUNDRIES is headquartered in Silicon Valley with manufacturing operations in Singapore, Germany, and a new leading-edge fab under construction in Saratoga County, New York. These sites are supported by a global network of R&D, design enablement, and customer support in Singapore, China, Taiwan, Japan, the United States, Germany, and the United Kingdom.
For more information on GLOBALFOUNDRIES, visit http://www.globalfoundries.com.
|
Related News
- Synopsys and GLOBALFOUNDRIES Collaborate to Develop Industry's First Automotive Grade 1 IP for 22FDX Process
- eMemory's Reprogrammable NeoMTP Qualified on GLOBALFOUNDRIES' 130nm BCDLite and BCD Technology Platforms for Automotive Applications
- SST Announces Qualification of Embedded SuperFlash on GLOBALFOUNDRIES' BCDLite Process
- GLOBALFOUNDRIES Offers New Low-Power 28nm Solution for High-Performance Mobile and IoT Applications
- MagnaChip Offers Automotive Qualified 0.18um Semiconductor Manufacturing Process Technology
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |