Fujitsu Standardizes on Cadence DFM Technologies for 28nm ASIC and Mixed-Signal Designs
Cadence Design for Manufacturing Gains Momentum as Fujitsu Selects “In-Design” Technology to Help Ensure Yield, Predictability and Faster Path to Silicon Realization
SAN JOSE, Calif., 19 Sep 2011 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Fujitsu Semiconductor Limited has adopted Cadence® signoff design-for-manufacturing (DFM) technologies for its complex 28-nanometer ASIC and system-on-chip (SoC) mixed-signal designs. Deploying the Cadence DFM offerings helps Fujitsu Semiconductor engineers ensure high yield, predictability, and a faster path to Silicon Realization for next-generation chips that will serve as the brains of the company’s advanced consumer electronics. The Cadence end-to-end digital and analog flows for Silicon Realization deliver DFM in-design technology within the Virtuoso® custom/analog and Encounter® digital flows.
“After an extensive evaluation of all vendors in the market, we selected the complete Cadence DFM set of technologies for our most advanced ASIC and SoC designs,” said Hiroshi Ikeda, director of the System LSI Technology and Design Platform Development Department at Fujitsu Semiconductor Limited. “The production-proven DFM technology gives us confidence in our ability to manage the complexity of advanced 28-nanometer effects in the fastest turnaround time, with the highest quality of silicon. Also, the seamless integration into the Cadence Virtuoso and Encounter flows makes it very straightforward for our design teams to adopt and fully leverage in their day-to-day work.”
Following comprehensive benchmarking, Fujitsu Semiconductor selected the Cadence Litho Physical Analyzer, Cadence CMP Predictor and Cadence Litho Electrical Analyzer for 28-nanometer in-design physical signoff and variability optimization for its ASIC and SoC designs.
As process geometries shrink beyond 28 nanometers, the Cadence DFM technologies enable Fujitsu Semiconductor to tackle the essential tasks of accurately modeling and predicting the impact of physical and electrical variability (layout dependent effects) on the yield and performance of a chip. Cadence in-design DFM signoff tools enable engineers to analyze these impacts, and fix problems, during digital and custom design implementation, rather than the traditional--and more costly and risky--route of addressing DFM signoff checks after the design is completed and ready to tape out.
“We have been focusing our resources and working with leading foundries to offer practical flows that enable companies like Fujitsu Semiconductor to design complex chips with confidence that they will meet ambitious goals of highest yield and quality,” said David Desharnais, group director, product marketing, Silicon Realization at Cadence. “We are seeing our Cadence DFM technologies, especially “in-design” DFM, being aggressively adopted and deployed by leading semiconductor companies because of its multi-foundry certification and ability to efficiently and effectively address this critical link in the design chain.”
The Cadence Litho Physical Analyzer leverages proprietary, foundational algorithms to provide near-linear scalability, thereby providing blazing fast silicon convergence. The Cadence CMP Predictor allows Fujitsu Semiconductor engineers to detect topography variations of their manufacturing process early on via extensive simulations. Fujitsu Semiconductor design teams use the Cadence Litho Electrical Analyzer to identify and optimize their libraries for layout-dependent effect variability early on, therefore ensuring that their design meets their planned performance metrics.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
|
Cadence Design Systems, Inc. Hot IP
Cadence Design Systems, Inc. Hot Verification IP
Related News
- Kandou Uses Cadence Analog/Mixed-Signal Timing and Power Signoff Tools to Deliver High-Speed SerDes PHY IP Design on 28nm Process
- Cadence Extends Spectre XPS to Support Mixed-Signal Designs
- Siemens delivers AI- accelerated verification for analog, mixed-signal, RF, memory, library IP and 3D IC designs in Solido Simulation Suite
- Cadence Unveils New Palladium Z2 Apps with Industry's First 4-State Emulation and Mixed-Signal Modeling to Accelerate SoC Verification
- UMC and Cadence Collaborate on Analog/Mixed-Signal Flow for 22ULP/ULL Process Technologies
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |