EnVerv Selects Tensilica for Smart Grid Power Line Communications
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
ConnX DPUs Provide Efficient Combination of Control and DSP
Santa Clara, CA USA- October 25, 2011 -Tensilica, Inc. today announced that EnVerv has licensed cores from the ConnX DSP (digital signal processors) family for use in a power line communications (PLC) system-on-chip (SOC) design for smart grid applications. Tensilica's ConnX DSPs are low-power, customizable dataplane processors (DPUs) that deliver outstanding performance on compiled C code, without the need for assembly code optimization.
"We picked the ConnX DSP core because of its flexible architecture and excellent processing power," stated Dr. Farrokh Farrokhi, executive vice president of engineering at EnVerv. "By using the ConnX DSP we were able to reap the benefits of implementing custom instructions that are unique to our signal processing algorithms, thus giving us the benefit of a custom DSP design while maintaining the flexibility of a soft architecture."
"The EnVerv application showcases the advantages of using a single Tensilica DPU architecture in an SOC design for signal processing, control and DSP," stated Steve Roddy, Tensilica's vice president of marketing and business development. "The ConnX DSP combines both control and DSP functions. Tasks can be easily shifted from one to the other depending on workload. Programming and software maintenance is easier because of the ability to customize the development tools for C code programming, with no need for assembly code optimization."
About EnVerv
EnVerv, Inc., is a venture-backed SOC company focused on designing communications chips for advanced metering infrastructure (AMI) and related power grid and utility applications. For more information, see www.enverv.com.
About Tensilica
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane processors combine the best capabilities of DSP and CPU while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- Smart Grid - Power metering: Dolphin Integration achieves range 1/5,000 with class 0.1 on silicon
- AnSem announces the availability of an Analog Front End that makes Power Line Communication for smart grids more reliable
- Major SoC Provider for China's Power Grid Market Licenses MIPS Technologies' Processor IP for Smart Grid Solutions
- ASIC Design Starts: Communications Dominate but Smart Grid and Transportation Growing Faster
- K-micro to Sample IEEE 1901 Compliant, Single Chip HD-PLC for 240Mbps High-Speed Power Line Communications
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |