English
TSMC's R&D chief sees 10 years of scaling
DylanMcGrath, EETimes
10/25/2011 2:45 PM EDT
SANTA CLARA, Calif.—The path is clear for continued semiconductor scaling using FinFETs for the next decade, down to the 7-nm node, according to Shang-Yi Chiang, senior vice president of R&D at foundry giant Taiwan Semiconductor Manufacturing Co.
Beyond 7-nm, the most pressing challenges to continued scaling will come from economics, not technology, Chiang said in a keynote address at the ARM TechCon event here Tuesday (Oct. 25).
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Intel's Bohr sees at least 10 more years of scaling
- Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C
- Semiconductor Leaders' Marketshares Swell Over the Past 10 Years
- Semiconductor Leaders' Marketshares Surge Over the Past 10 Years
- Top 10 Semiconductor R&D Spenders Increase Outlays 6% in 2017
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks