English
TSMC's R&D chief sees 10 years of scaling
DylanMcGrath, EETimes
10/25/2011 2:45 PM EDT
SANTA CLARA, Calif.—The path is clear for continued semiconductor scaling using FinFETs for the next decade, down to the 7-nm node, according to Shang-Yi Chiang, senior vice president of R&D at foundry giant Taiwan Semiconductor Manufacturing Co.
Beyond 7-nm, the most pressing challenges to continued scaling will come from economics, not technology, Chiang said in a keynote address at the ARM TechCon event here Tuesday (Oct. 25).
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Intel's Bohr sees at least 10 more years of scaling
- Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C
- Semiconductor Leaders' Marketshares Swell Over the Past 10 Years
- Semiconductor Leaders' Marketshares Surge Over the Past 10 Years
- Top 10 Semiconductor R&D Spenders Increase Outlays 6% in 2017
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era