Cadence CEO laments loss of VC in semis
SylvieBarak, EETimes
10/26/2011 2:24 PM EDT
SANTA CLARA, Calif.--Collaboration and more semiconductor VC investment is what’s needed to continue innovation in the hi-tech space, said Lip-Bu Tan, president and chief executive officer of Cadence Design Systems Inc., in a fireside chat with ARM’s executive vice Simon Seagers at TechCon.
With new technologies driving relationships between companies up and down the ecosystem, Tan--a longtime venture capitalist who remains chairman of Walden International, the VC fund he founded in 1989--agreed that collaboration had become an essential ingredient to product innovation, from startups to larger, more established companies.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Cadence Design Systems, Inc. Hot IP
Cadence Design Systems, Inc. Hot Verification IP
Related News
- Xilinx CEO: Venture capital won't return to semis
- Cadence Announces Anirudh Devgan to Become CEO in December 2021; Lip-Bu Tan to Transition to Role of Executive Chairman at That Time
- Oasys Announces New Funding Led by Intel Capital, Xilinx and former Cadence CEO Joe Costello
- Cadence CEO sees design activity keeping pace
- Cadence CEO: Chip execs eye China, India
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset