7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
TI talks future-proofing for Omap
Sylvie Barak, EETimes
11/3/2011 4:10 PM EDT
MOUNTAIN VIEW, Calif.--Tomorrow’s mobile application processor will not only be capable of rendering holographic displays, high-definition augmented reality, real-time voice translation, natural speech interaction and multi-view synthesis, but may also be able to handle neuro, fuzzy-based and even humanistic intelligence according, to Texas Instruments Inc.
Talking about the capabilities its Omap 4 processor has today and those working their way down the pipeline as Omap 5 approaches sampling readiness in 2012, TI’s Avner Goren, director of strategic marketing for wireless terminals, outlined use case scenarios including smell sensors, environment sensors and multi-mode gesture sensors.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Kudelski IoT Launches Quantum-Resistant Security IP, Future-Proofing Semiconductors Against Emerging Quantum Threats
- TI to reduce costs in Wireless business; OMAP processors and wireless connectivity solutions will focus on embedded markets
- Does Amazon want TI's OMAP?
- TI steering OMAP to embedded
- EVE's Hardware-Assisted Verification Platform Accelerates Embedded Software Development for Texas Instruments' OMAP 5 Platform
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset