TSMC sees signs of market turning up
Peter Clarke, EETimes
11/7/2011 9:42 AM EST
LONDON – Although foundry Taiwan Semiconductor Manufacturing Co. Ltd. suffered a third quarter that was down sequentially against its second quarter, the company is starting to see signs of a turn in the market, according to its leading European executive.
This is partly because concerns about the global economic situation during 2011 has caused electronic equipment and chip companies to strive to burn off inventory, and that process has now reached close to a minimum, according to Maria Marced, European president of TSMC.
E-mail This Article | Printer-Friendly Page |
Related News
- TSMC signs up Apple for three-year FinFET deal
- Signs Point to a Short Slowdown - IPI Ticking UP!
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- Innova finalizes its flow and resource management software platform and opens up to the international market
- Will 1.4-nm help Samsung catch up with TSMC, IFS?
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards