Noesis Technologies L.P. becomes a full member of Hellenic Semiconductor Industry Association
Patras, Greece – December 1, 2011. Noesis Technologies L.P. (NOESIS), a leading provider of telecom Silicon IP Cores, has announced today that has been admitted as a full member of Hellenic Semiconductor Industry Association (HSIA) during HSIA’s General Assembly held on November 25th.
“We are excited to have Noesis join Hellenic Semiconductor Industry Association as a full member and partner in reaching our vision of establishing the Greek Microelectronics Industry as a dynamic player of the global high-tech market”, said Mr Yorgos Koutsoyannopoulos, Chairman at HSIA.
Commenting on NOESIS admittance in HSIA, George Krikis, CEO at NOESIS, said: “We are very pleased and honored to join HSIA’s ecosystem. Being a full HSIA member is a clear recognition of the quality of our products and services”.
About Noesis Technologies L.P.
Noesis Technologies L.P., is a world-wide leading provider of production proven, process independent and parameterizable telecom IP cores, designed from the ground-up; our IP cores present an industry-leading combination of high performance, low power and low die-area, as well as easy customization for adaptability to a wide range of applications in the System On a Chip (SoC) era. For more information please visit NOESIS web site: www.noesis-tech.com
About Hellenic Semiconductor Industry Association.
The Hellenic Semiconductor Industry Association (HSIA) was launched in 2005 as a non-profit association of high tech industries to represent the dynamic Greek sector of semiconductors, micro- & nano- electronics and embedded systems. HSIA brings together 50 industrial members and over 30 relevant universities and institutes in Greece and abroad. HSIA is a proud member of the European Semiconductor Industry Association (ESIA) and the Global Semiconductor Alliance (GSA). more information please visit CEM web site: www.hsia.gr
|
Noesis Technologies Hot IP
Related News
- CEM Solutions Pvt Ltd. selects Noesis Technologies L.P. Audio Codec for its new generation VoIP product
- CAST Inc. and SignalGeneriX Ltd Join the Hellenic Semiconductor Industry Association
- HDL Design House joins the Hellenic Semiconductor Industry Association
- eASIC Becomes Member of FSA and Recognizes the Association for Industry Leadership, Research and Cooperation
- Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |