Leading-edge demonstration of Application Hardware Modeling for SoC Integrators and Application Engineers of Fabless suppliers by Dolphin Integration
Grenoble, France, December 5, 2011. Dolphin Integration, the mixed-signal Silicon IP and EDA Solutions provider announces the availability of demonstrators of the usefulness of Application Hardware Modeling (AHM) to ensure the performance of Silicon IP or IC at PCB/System level, as soon as possible in the design and integration process.
The traditional approach, which consists in designing a Silicon IP or an IC without considering the Application Schematics of reference for the system, may lead to unexpected performance drops, impacting both Time-To-Market and RoI.
As an illustration, shCOD95.SP04-Helium2, a high-resolution audio CODEC, has been fully designed with SLASH, the multi-domain solution enabling simulation astride SoC and PCB. The performances of shCOD95.SP04-Helium2 - such as SNR, THD… - have been simulated with its Application Schematics of reference, taking into consideration the critical issues to be mastered such as Jitter, Pop-up noise, and Noise propagated through the power supply.
The correlation between the simulated results and the measurements on the characterization board, designed in accordance with the Application Schematics of reference, demonstrates the efficiency of Application Hardware Modeling to minimize Time-to-Market.
The multi-level and multi-domain capabilities of SLASH then allow Application Engineers of Fabless makers to rely on a powerful solution to support their users in the process of optimizing the Application Schematics of the system embedding the SoC.
In complement to SLASH, the company promotes a product offering for the design of Virtual Application Boards (VAB), which enables Application Engineers to benefit from know-how transfer for dealing with critical issues related to the optimization of Application Schematics.
Demonstrations of the effectiveness of Application Hardware Modeling for both SoC designers and for Application Engineers will be provided during IP-SoC 2011 to be held in Grenoble on December 7 and 8.
They show how to fix integration issues such as Jitter, Pop-up Noise… but also how to optimize the cost of an application schematic for a given SNR target.
For more information on Dolphin Integration offering, meet us at our booth #15 at IP-SOC 2011 on December 7 and 8 held in Grenoble or contact Nathalie Dufayard at solutions@dolphin.fr
ABOUT DOLPHIN INTEGRATION
Dolphin Integration is up to their charter as the most adaptive and lasting creator in the Microelectronics Design Industry to "enable mixed signal Systems-on-Chip". It stars a quality management stimulating reactivity for innovation as well as independence and partnerships with Foundries. Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components. The strategy is to follow product launches with evolutions addressing future needs, emphasizing resilience to noise and drastic reductions of power-consumption at SoC level, thanks to their own missing EDA solutions enabling Integration Hardware Modeling (IHM) and Application Hardware Modeling (AHM) as well as early Power and Noise assessment, plus engineering assistance for Risk Control.
|
Dolphin Design Hot IP
Related News
- Dolphin Integration revolutionizes subsystem performance validation with Application Hardware Modeling
- DOLPHIN Integration is completing its offering of Custom Training Products after a market test in Asia
- DOLPHIN Integration promotes Application Hardware Modeling to optimize system functions
- Socionext to Showcase Leading-Edge Technologies at CES 2024, Featuring Custom SoC Solutions, Low Power Sensors, Smart Display Controller, and Advanced Image Processor
- Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |