Rambus and ITRI Collaborate to Develop Interconnect and Advanced 3D Packaging Technologies
Rambus joins Ad-STAC consortium
SUNNYVALE, Calif.--December 15, 2011-- Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies, announced today it is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan, one of the world's leading research institutes, on the development of interconnect and 3D packaging technologies.
In addition, Rambus has joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI. Rambus and ITRI will work together as members of Ad-STAC on the development of system integration using silicon interposer technology. The collaboration combines ITRI's strength in manufacturing and advanced process technologies as well as the strong system, package and signaling design experience of Rambus.
Initially, the two companies will work together on the development of system integration using silicon interposer technology.
"Collaborating with leading research institutions, such as ITRI, is an effective way for us to advance 3D packaging technology for the broader manufacturing community," said John Kent, vice president of Technology Development at Rambus. "Combining Rambus experience in high-performance system design and ITRI package research experience can enable new breakthroughs in 3D IC system integration and design."
"This collaboration brings together Rambus' advanced high-bandwidth and low-power device designs and ITRI's know-how in fabrication with our 12-inch equipment," said Dr. Ian Chan, VP and general director of the Electronics and Optoelectronics Research Laboratories at ITRI. "We expect to achieve some compelling and useful results through our joint efforts."
About ITRI
ITRI is a national research organization that serves to strengthen the technological competitiveness of Taiwan. Since the inception in 1973, ITRI has played a vital role in transforming Taiwan's economy from a labor-intensive industry to a high-tech industry. Numerous well-known high-tech companies in Taiwan, such as leaders in the semiconductor industry TSMC and UMC, can all trace their origins to ITRI. To date, ITRI has cultivated 70 CEOs, 165 innovative companies, and accumulated more than 10000 patents. The six fields ITRI focuses on include Information and Communications; Electronics and Optoelectronics; Material, Chemical and Nanotechnology; Medical device and biomedical; Mechanical and Systems; as well as Green Energy and Environment. Learn more at www.itri.org.tw.
About Rambus Inc.
Founded in 1990, Rambus is one of the world's premier technology licensing companies. As a company of inventors, Rambus focuses on the development of technologies that enrich the end-user experience of electronic systems. Its breakthrough innovations and solutions help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Rambus has offices in California, North Carolina, Ohio, India, Germany, Japan, Korea, and Taiwan. Additional information is available at www.rambus.com.
|
Related News
- Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs
- Imec and Synopsys Collaborate on Interconnect Resistivity Model to Enable Early Screening of Interconnect Technology Options at Advanced Nodes
- Sonics and AlphaChips Collaborate to Develop Advanced SoC Design Platforms
- Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs
- GLOBALFOUNDRIES and Rambus Collaborate To Develop Broad IP Portfolio for 14nm-XM FinFET Process Technology
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |