UMC Pushes 8" Manufacturing Limit with A+ Technology Solution
0.11um Al-BEoL platform the most comprehensive solution among all foundries
HSINCHU, Taiwan, December 30, 2011 -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced its A+ technology platform, a specialized 0.11um aluminum process manufactured in UMC’s 8” fabs. UMC is the only foundry to offer the most complete 0.11um full aluminum BEoL (Back End of Line) process, providing customers with a cost effective alternative to mainstream 0.13um and 0.11um copper technologies. The unique A+ platform consists of a comprehensive blend of technology offerings that no other foundry can provide, which include logic/MM, RFCMOS, eFlash, eE2PROM, eHV and CIS to address customers’ integration, performance, and cost requirements.
Steve Wang, vice president of Asian sales and Corporate Marketing at UMC, said, “There are many applications still enjoying a comfort zone within 8” manufacturing facilities due to the attractive cost vs. performance benefits. For applications such as timing controllers, LCD controllers, remote controller, small panel display drivers, surveillance and medical CMOS Image sensors, etc., A+ is the perfect technology sweet spot. With its comprehensive technology portfolio, the A+ solution offers an ideal migration path for 0.18um or existing 0.13/0.11um Cu-BEoL products so that customers can differentiate their market position for increased competitiveness.”
The unique A+ 0.11um specialty platform incorporates state-of-the-art solutions to help designers find an optimal balance between cost, performance, and functionality. A+ combines the most leading-edge 8” production technology with aggressive Al-BEOL design rules. A full suite of IP, HV-LDMOS, I/O devices, RF models and passive components complete the comprehensive A+ offering, with flexible 8-inch manufacturing capacity to support customer production requirements.
About UMC
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning every major sector of the IC industry. UMC’s customer-driven foundry solutions allow chip designers to leverage the strength of the company’s leading-edge processes, which include production proven 65nm, 45/40nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 14,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.
|
Related News
- NEDO Approves Rapidus' FY2024 Plan and Budget for "Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration"
- Faraday Unveils Enhanced Gigabit Ethernet PHY on UMC's 28HPC+ Process
- SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speck™" to mass production
- UMC Introduces New 28eHV+ Platform for Wireless, VR/AR, and IoT Display Applications
- Split manufacturing for trustworthy electronics "Made in Germany"
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |