English
Multi-Video-Source Multiplexing Serial Video Transmitter for MIPI CSI2
InComm SoC platform supports various CPU cores
 |
InComm SoC platform supports various CPU cores
By Mike Pan, EE Times
April 3, 2002 (3:25 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020403S0017
TAIPEI, Taiwan—InComm Technologies Co. Ltd., a Taiwan-based system-on-chip services provider, has introduced a platform dubbed InPlat to accelerate the SoC design process. "The platform is specially designed for applications such as communications and multimedia," said InComm president Tony Lo.
Lo said that unlike other SoC platforms, InPlat supports CPU cores from different vendors such as ARM Ltd. and Tensilica Inc. Thus, taking a processor's functionality and cost into account, a customer can choose a suitable CPU for its target product. Apart from the CPU, the platform includes other intellectual-property cores such as USB and UART.
Half the time
"The integration of design-and-verification flow and FPGA design flow enables InPlat to shorten our customers' design process," said Lo, who estimated that InPlat could essentially halve the time taken by a conventional design flow.
InComm said it has also si gned an agreement with Adamya Technologies Inc., a specialist in delivering wireless solutions on a chip. Under terms of the deal, InComm can use Adamya's Bluetooth software baseband technology.
Mike Pan is bureau chief of sister publication EE Times-Taiwan.
Related News
- Exostiv Labs Unveils AMD Versal Adaptive SoC Device Support for Exostiv and Exostiv Blade Platforms
- ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform
- ESWIN Computing Pairs SiFive CPU, Imagination GPU and In House NPU in Latest RISC-V Edge Computing SoC
- Primemas Selects Achronix Embedded FPGA Technology For System-on-Chip (SoC) Hub Chiplet Platform
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
|
E-mail This Article | 
|
|
Printer-Friendly Page |