Moortec Extend Temperature Sensor IP Offering to Global Foundries 28nm
January 4 2012 -- lymouth, UK - Moortec Semiconductor Ltd., provider of analog IP and semiconductor design services, are to extend their embedded temperature sensor IP range to Global Foundries' 28nm technology. The IP, which is already available on TSMC's standard 65nm, 40nm and 28nm CMOS technologies, is typically applied for ASIC performance optimization, thermal management, device reliability, temperature sensing during device qualification (or burn-in) and device security.
“As silicon geometries shrink, on-chip temperature monitoring has become vital to optimize performance and to increase IC longevity,” said Stephen Crosher, managing director of Moortec Semiconductor. “We are now committed to extending our IP offering to Global Foundries, which will further underline our position as a key vendor for this category of IP.”
About Moortec
Moortec, established in 2005, provide high quality analog and mixed-signal IP blocks as well as Custom Chip solutions world-wide for a variety of applications. The UK based design group also provide Platforms for IC test and evaluation. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations.
|
Related News
- Moortec Semiconductor Announces New UMC 28nm HPC High Accuracy Embedded Temperature Sensor
- Moortec Deliver Analog IP at 40nm and 28nm
- Moortec Embark on 40nm and 28nm Temperature Sensor IP Deliveries
- Achronix Selects Moortec's 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
- MicroBT employs Moortec's 16nm Embedded Temperature Sensor in their HPC ASIC
Breaking News
- VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
- Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |