TSMC's 28-nm process in trouble, says analyst
Peter Clarke, EETimes
1/20/2012 6:25 AM EST
LONDON – Mike Bryant, technology analyst with Future Horizons Ltd. has said that foundry Taiwan Semiconductor Manufacturing Co. Ltd. is in trouble with its 28-nm manufacturing process technologies, which are not yet yielding well. Bryant referenced un-named contacts made with multiple companies waiting for designs to be produced by TSMC on 28-nm processes.
E-mail This Article | Printer-Friendly Page |
|
Related News
- M31 Technology Develops SRAM Compiler IP on TSMC's 28nm Embedded Flash Process Technology Providing High Performance and Low Power Solutions
- Menta Embeds sureCore Low Power SRAM IP on TSMC's 28nm Process
- Menta Offers Validation Board for Embedded FPGA Supporting TSMC's 28nm HPC+ Process
- PLDA and GUC Announce Industry's First Successful PCIe Gen 3 Controller and PHY Combination on TSMC's 28nm HPM Process Technology
- TSMC's Chang: 'The worst is behind us' on 28-nm
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards