TI unveils ZigBee Smart Energy 2.0 system-on-chip with integrated ARM Cortex-M3 processor and memory
SE2.0 SoC and 802.15.4g radio tailored for Smart Grid and remote sensor applications in industry-first demonstrations at DistribuTECH 2012
DALLAS, Jan. 23, 2012 -- Texas Instruments Incorporated (TI), the leader in highly integrated wireless connectivity solutions, today announced the industry's first demonstration of a radio frequency (RF) system-on-chip (SoC) that integrates an IEEE 802.15.4 (2.4 GHz) radio, an ARM® Cortex™-M3 processor, dedicated Smart Energy (SE) 2.0 hardware security acceleration, and enough flash and RAM to run the ZigBee® IP stack and SE2.0 profile. A true single-chip solution, the CC2538 ZigBee SE2.0 SoC removes the need for an additional microprocessor and will enable simplified, cost-effective development of SE2.0 compliant Smart Grid and remote sensor connectivity applications such as electricity, gas or water smart meters and in-home displays.
The CC2538 will support TI's Z-Stack™ ZigBee protocol stack, which features full SE1.1 functionality. The SE2.0 profile is architected to interface with multiple TI PHYs, allowing the design of SE2.0 products that can run across ZigBee, Wi-Fi® or power line networks including TI's ZigBee processors (CC253x) and WiLink™ 6.0 solutions (WL127x). As the SE2.0 market expands this will enable customers to use ZigBee or Wi-Fi to connect to existing and new infrastructure or use Wi-Fi as a bridge for ZigBee to connect to the Internet.
Also being demonstrated at DistribuTECH 2012 is TI's high performance CC1200 RF transceiver. The CC1200, an evolution of the CC1120 sub-1 GHz RF performance line, supports the full bandwidth of the 802.15.4g standard for wireless smart utility networks in the sub-1 GHz bands. The CC1120, CC1200 and CC2538 will be demonstrated at DistribuTECH 2012 in the TI booth #4735, January 24-26, 2012 in the Henry B. Gonzales Convention Center in San Antonio, Texas. For more information on the CC2538 or CC1200, contact TI on smartenergy@list.ti.com.
"We are proud to deliver a complete SE2.0 platform for early adopters to quickly develop SE2.0 compliant devices without the added cost of a microcontroller or external memory," said Oyvind Birkenes, general manager, low-power RF, TI. "Our team has been instrumental in the development and technical editing of the SE2.0 IP stack and profile within the ZigBee Alliance and we are excited to see the market evolve with new products based on TI's CC2538 SE2.0 SoC and CC1200 for sub-1 GHz solutions."
Availability and price
A CC2538 development platform is sampling to early adopters through the low power RF developer network now. Volume production and sale through authorized distributors is expected in 4Q 2012. The CC1200 will start sampling in late 1Q 2012 with volume production expected in 4Q 2012.
Find out more about TI's wireless connectivity and Smart Grid solutions
- TI's ZigBee solutions: www.ti.com/zigbee-pr
- View TI's Smart Energy Profile Demonstration (SEP 2.0) video here
- TI's Smart Grid solutions: www.ti.com/smartgrid
- TI's wireless connectivity solutions: www.ti.com/wirelessconnectivity
- TI's CC1120 RF performance line www.ti.com/rfperformanceline
- TI E2E™ wireless connectivity support community: www.ti.com/wicon-forum
- TI's wireless connectivity eNewsletter: www.ti.com/wcsnewsletter
About TI's wireless connectivity portfolio
TI provides the industry's broadest portfolio of mature wireless connectivity solutions. With expertise in more than a dozen technologies, TI ensures customers the best-suited wireless connectivity for every type of application. TI's product portfolio is complemented with the support and tools that customers and developers need to quickly and easily bring wirelessly connected designs to market. Visit the company's Wireless Connectivity Portal for an overview of TI-supported technologies, the full product portfolio, and example use cases.
TI's Smart Grid solutions
With millions of energy meter ICs shipped over the past decade, Texas Instruments Incorporated (TI) is the global systems provider for innovative, secure, economical and future-proof solutions for the worldwide smart grid. TI offers the industry's broadest smart grid portfolio of metrology expertise, application processors, communication systems, wireless connectivity and analog components in readily available silicon, with advanced software, tools and support for compliant solutions in grid infrastructure, utility metering, and home or building automation. Learn more at www.ti.com/smartgrid.
About Texas Instruments
Texas Instruments semiconductor innovations help 80,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at www.ti.com.
|
Related News
- VeriSilicon's Artificial Intelligence Processor IP Used in Next-Generation Large Screen Smart Home System-on-Chip (SoC)
- XMOS creates the next wave in programmable system-on-chip products
- Dust Networks Announces ARM Cortex-M3 Processor Based IEEE 802.15.4 SOC
- Cavium Networks Introduces ECONA Family of Super Energy Efficient ARM-Based System-on-Chip (SoC) Processors for the Digital Home That Break the 1 Watt Barrier
- Ember and ARM Target High Performance ZigBee Networks
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |