Shanghai HDIC Picks Tensilica's HiFi Audio DSP For Digital Television System-on-Chip
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
Santa Clara, CA - January 24, 2012 -Tensilica, Inc. today announced that Shanghai High Definition Digital Technology Industrial Corporation (HDIC) has selected Tensilica's HiFi Audio DSP for its audio requirements for a digital television (DTV) SOC (system-on-chip) for the Chinese DTV market.
"We picked Tensilica's HiFi Audio because it has become the industry standard for audio DSP," stated Dr. Jun Sun, president of HDIC. "HiFi Audio provides superior performance and smaller size/power and is proven in millions of products. Moreover, Tensilica has the most complete library with over 90 audio codecs readily available."
"HDIC is doing some very innovative work to accelerate the adoption of DTMB, the China Digital Terrestrial Broadcast and we're pleased that they chose our HiFi Audio DSP for their SOC," stated Steve Roddy, Tensilica's vice president of marketing and business development.
About Shanghai HDIC
Shanghai High Definition Digital Technology Industrial Corporation (HDIC) is a fabless semiconductor company focused on developing fully standards compliant digital television terrestrial silicon chips, IP and system solutions. The company has received investment from Shanghai Jiao Tong University, Pudong State Owned Assets Committee, and Shanghai Venture Capital. The company is a key research and development leader and core contributor to the Chinese Digital Television Terrestrial Broadcasting standard (GB20600-2006). For more information, visit www.hdigroup.net.
About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- Dialog Semiconductor Licenses Cadence's Industry-Leading Tensilica Hifi Audio/Voice DSP IP
- Hisense Picks Tensilica's HiFi Audio/Voice DSP and Software Codecs for DTVs
- LG Electronics Picks Tensilica's HiFi Audio DSP and SW Codecs for HDTV
- HiSilicon, a Division of Huawei, Extends License of Tensilica's IP Cores, ConnX Baseband Engine, and HiFi Audio DSP for LTE Base Stations and Handsets
- Samsung Signs Multi-Year License For Tensilica's HiFi 2 Audio DSP
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |