Systemcom Ltd announces silicon validated Current-Input Analogue Front End IP module
Zagreb, Croatia - January 27, 2012 - Systemcom Ltd announces silicon validated Current-Input Analogue Front End IP module, designed like sensor signal interface, primarily intended for processing current given by the sensor at the input of electronic system.
Interfacing numerous sensors with current outputs in various industrial and consumer applications is made easy applying this IP module. The excellent features make this IP module the ideal solution for interfacing optical sensors as a phenomenon detector in biomedical applications, for example in blood-oximeters. It is also very applicable to a broad range of chemical sensors (oxygen sensor, CO sensor, etc.) used for example in environment-quality monitoring.
The current input for the IP module is solved by the original transimpendance amplifier (TIA) architecture with unique offset cancelling solution, giving very good linearity and fast current to voltage conversion. Wide range of conversion ratios together with programmable gain amplifier (PGA) enables measurement of low input absolute current values in the range of hundreds of picoA to 1 mA and measurement of relative current down to the level of tens of picoA. The integrated S&H circuit with fully differential output makes it convenient for implementation into SoC system and further signals processing.
The module operates at supply voltages from 1.6 V to 1.8 V in temperature range from -40°C to 125°C. The IP module is silicon validated in TSMC 180 nm mixed signal CMOS technology.
|
Related News
- Systemcom Ltd launches new silicon validated Current-Input Analogue Front End with Digital Control and SPI Interface at TSMC 180nm
- VT Silicon Selects TowerJazz for World's First Fully Integrated 4G RF Front End IC
- Omni Design's High Performance Analog Front Ends are Adopted in Socionext's Next Generation Communications SoCs
- CEVA Audio Front End Software Solution Becomes Alexa Voice Service (AVS) Qualified
- Weebit Nano receives first silicon demonstration wafers integrating its embedded ReRAM module
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |