Infineon's New ORIGA 2 Authentication Chip with MIPI BIF Standard Interface Protects Mobile Device Users Better Against Counterfeit Components
Neubiberg, Germany and Barcelona, Spain – February 27, 2012 – Infineon Technologies (FSE: IFX/OTCQX: IFNNY) has added a product to the ORIGA™ family of authentication solutions: The new ORIGA™2 chip integrates a communication interface supporting the MIPI BIF standard defined by the MIPI Alliance. MIPI BIF (Battery Interface) is the first standardized single-wire interface for communication between the mobile device and battery pack. The standardization facilitates the development of intelligent batteries that authenticate and constantly monitor and report important battery parameters, such as temperature. This helps to enhance user’s protection from potentially dangerous counterfeit batteries in mobile devices such as smart phones or tablet computers. The mobile device for example will only operate with advanced features like fast charging, if the ORIGA™2 chip authenticates the battery as an original product.
The Infineon ORIGA™2 chip is also suitable for printer cartridges, replacement parts, medical disposables, network components or accessories such as earphones, speakers, docking stations and chargers. Increased key length and other features further increase the security of Infineon’s ORIGA™2 solution. In addition, the ORIGA™ Digital Certificate feature enables the provision of chip-individual keys. The ORIGA™2 chip uses asymmetric authentication based on elliptic curve cryptography (ECC) already introduced in ORIGA™1. ECC authentication utilizes two different keys: a public key on the host side, in the mobile phone for instance, and a private key on the battery side, which is protected in the ORIGA™ chip. This provides improved security at reduced system cost because on the host side the public key can be implemented in software without compromising security.
“Infineon’s ORIGA™2 solution brings significant benefits in clone prevention and temperature monitoring: For designers and developers of smart phones as well as for all other OEMs using batteries and accessories. The new MIPI BIF standard helps to Enhance User’s Protection from Counterfeit Mobile Device Components,” says Sandro Cerato, Vice President Power Management & Multimarket Division at Infineon Technologies.
The ORIGA™ chips provide battery and electronics manufacturers with counterfeit detection capability to prevent device failure or damage due to unauthorized components. Device users are protected from accidents and injuries possibly caused by non-approved, untested accessories and batteries – in notebooks or mobile phones, for instance.
Infineon’s ORIGA™2 chip (product name SLE95200) is designed for temperatures from -25 to +85 degrees Celsius and for an operating voltage range of 2.5 V to 4.8 V. It will be available from the fall of 2012 in an ultra-small chip-scale package and in a very small QFN package.
Further information on Infineon’s ORIGA™ solution at www.infineon.com/ORIGA
More information on the MIPI Alliance and on MIPI BIF is available at www.mipi.org. The latest press release on MIPI BIF can be found at www.mipi.org/news-events/pressreleases
Infineon’s ORIGA™2 is highlighted at Mobile World Congress 2012 (February 27 - March 1) in Barcelona, Spain as part of the MIPI Stand 7H11in Hall 7.
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2011 fiscal year (ending September 30), the company reported sales of Euro 4.0 billion with close to 26,000 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com.
|
Related News
- MIPI Alliance Delivers Seven Vital Mobile Device Interface Specifications in 2008
- MIPI Alliance Updates its MIPI RFFE Interface for Mobile Device RF Front-End Architectures
- Tower Semiconductor Enhances Fab 2's IP Portfolio With Artisan Components' Industry-Standard Design Platforms
- M31 demonstrates high-speed interface IP development achievements on TSMC's 7nm & 5nm process technologies
- MIPI RFFE (RF Front-End Control Interface) v3.0 Master and Slave Controller IP Cores for ultimate control of your RF Front-end Cellular or Base station SoC's with Low Power Consumption and Reduced Latencies
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |