Cadence Delivers High-Performance, Low-Power Design IP Supporting LPDDR3 Memory Standard
New Cadence Controller and PHY IP Solution Supports Latest Version of Memory Interface for Smartphone and Tablet Applications
SAN JOSE, CA, Mar 21, 2012 -- Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced the addition of design intellectual property (IP) for the LPDDR3 mobile memory standard to the company's design IP portfolio. Designed to provide the high bandwidth and low power consumption required by smartphones and tablets, the Cadence LPDDR3 memory IP solution includes integrated controller and PHY support, virtual prototyping, verification IP and Allegro(R) design-in kits to accelerate implementation and reduce design risk. Cadence's highly configurable design IP allows the LPDDR3 standard to be combined with others in a single controller and PHY to enable SoCs that support multiple memory standards, making one design usable by multiple markets.
"To keep pace with the growing processing capabilities of today's smartphones and tablets, SoC designers must support memory standards that are evolving just as quickly," said Marc Greenberg, director of product marketing, SoC Realization Group, Cadence. "At Cadence, our goal is to enable early access to these standards by offering customers a broad range of high-performance, low power design IP standards, like LPDDR3, so they can quickly integrate the standard into new SoC designs."
As part of the LPDDR3 launch, Cadence has upgraded the bandwidth management engine, Placement Queue 2.2, to optimize the way memory is accessed to improve overall system performance and power consumption.
In addition to LPDDR3, Cadence offers IP for other mobile and non-mobile memory standards in high demand by SoC designers, including Wide I/O and DDR4. More information about the Cadence verification IP catalog and the Allegro Design-in kits is available on the Cadence web site.
About LPDDR3
The LPDDR3 standard will offer an extension to the bandwidth of LPDDR2, reaching 6.4GByte/s per die (1600MT/s per pin) and allowing 12.8GByte/s for a dual channel configuration. It will support both PoP and discrete packaging types, allowing versatile usage. LPDDR3 will preserve the power-efficient features of LPDDR2, allowing for fast clock stop/start, low-power self-refresh, and smart array management. For more information about LPDDR3, please visit JEDEC, the microelectronics industry's open standards organization.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com .
|
Cadence Hot IP
Related News
- Cadence and Arm Deliver First SoC Verification Solution for Low-Power, High-Performance Arm-Based Servers
- Kilopass to Demonstrate Ultra Low-Power, High-Performance Non-Volatile Memory IP at GSA Memory+ Conference in Tokyo
- Kilopass to Demonstrate Ultra Low-Power, High-Performance Non-Volatile Memory IP at CSIA-ICCAD 2014 in Hong Kong
- Sidense SHF Embedded Memory Macros Target High-Performance and Low-Power Applications in TSMC 28nm Processes
- NEC Electronics America Uses Cadence Encounter for High-performance, Low-power ARM11 Processor
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |