English
Nvidia calls for move to 450mm wafers
Rick Merritt, EETimes
4/12/2012 4:17 PM EDT
SANTA CLARA, Calif. – A top Nvidia engineer is calling for a move to 450mm wafers as one part of the solution to the growing complexity, cost and time-to-market challenges in chip design.
A diverse host of new technologies and methods will be needed to keep the industry on track to profitably deliver a trillion-transistor device by the end of the decade, said Sameer Halepete, vice president of VLSI engineering at Nvidia.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks