TSMC's Chang: 'The worst is behind us' on 28-nm
Dylan McGrath, EETimes
4/17/2012 11:20 PM EDT
SAN JOSE, Calif.—Morris Chang, chairman and CEO of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), acknowledged Tuesday (April 17) that the foundry giant has experienced issues at the 28-nm node, but said the problems were related to capacity, not yield.
Chang told an audience at TSMC's annual technology symposium that TSMC's 28-nm yields have from the beginning been in line with the firm's projections.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- TSMC's 28-nm process in trouble, says analyst
- TSMC: 28-nm tech, demand 'on plan'
- Report: Altera to get TSMC's 28-nm in Q4
- Magma's Quartz Physical Verification Software Used by TSMC on Complex 28-nm Product Qualification Vehicle Test Chip -- Delivers Sign-Off Accuracy Along With Required Performance and Capacity
- EDA toolset parade at TSMC's U.S. design symposium
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset