TSMC's Chang: 'The worst is behind us' on 28-nm
Dylan McGrath, EETimes
4/17/2012 11:20 PM EDT
SAN JOSE, Calif.—Morris Chang, chairman and CEO of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), acknowledged Tuesday (April 17) that the foundry giant has experienced issues at the 28-nm node, but said the problems were related to capacity, not yield.
Chang told an audience at TSMC's annual technology symposium that TSMC's 28-nm yields have from the beginning been in line with the firm's projections.
E-mail This Article | Printer-Friendly Page |
|
Related News
- TSMC's 28-nm process in trouble, says analyst
- TSMC: 28-nm tech, demand 'on plan'
- Report: Altera to get TSMC's 28-nm in Q4
- Magma's Quartz Physical Verification Software Used by TSMC on Complex 28-nm Product Qualification Vehicle Test Chip -- Delivers Sign-Off Accuracy Along With Required Performance and Capacity
- EDA toolset parade at TSMC's U.S. design symposium
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards