No fab for Qualcomm but firm mulls business evolution
Peter Clarke, EETimes
4/20/2012 10:37 AM EDT
LONDON – The problems acknowledged by Qualcomm Inc. in getting enough 28-nm chips out of its foundry partner Taiwan Semiconductor Manufacturing Co. Ltd. are not about to prompt the company to build or acquire its own fab, according to Steve Mollenkopf, chief operating officer of the fabless chip company. But ways of doing business are evolving and Qualcomm is big enough to shape these to its own benefit, he said.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Report: TSMC's Chang says no to buying Renesas fab
- No cost benefit in China wafer fab, says TSMC's Chang
- ESMC Breaks Ground on Dresden Fab
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- After TSMC fab in Japan, advanced packaging facility is next
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets