Chip execs see 20 nm variants, 3-D ICs ahead

Rick Merritt, EETimes
4/27/2012 12:43 AM EDT

MOUNTAIN VIEW, Calif. – Next-generation 20 nm processes can support optimized versions for low power and high performance, according to an IBM expert. GlobalFoundries will decide in August whether or not it will offer such variations.

Those were just two data points from wide ranging discussions at the GSA Silicon Summit here. Separately, executives said a variety of 3-D ICs will hit the market in 2014 despite numerous challenges, and CMOS scaling is slowing down but still viable through a 7 nm node.

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