Huawei and Intel Collaborate on LTE TDD
Companies creating a China-based IOT lab to accelerate development of the ecosystem
Beijing, China, April 27 , 2012 -- Intel Corporation and Huawei, a leading global information and communication technology (ICT) solutions provider, today announced a collaboration to advance the development of interoperability testing and deployment of LTE TDD solutions. The two companies will establish joint lab set-up based in China for IOT (Interoperability Test) and fast implementation of LTE TDD technology.
"Huawei has been committed to LTE TDD commercial deployment worldwide," said Deng Taihua, president LTE TDD & WiMAX &TDS wireless networks, Huawei. "We will continuously invest in LTE TDD research and deployment as well as the global expansion of LTE TDD networks. We are excited to partner with Intel to accelerate the development of our technology and provide our customers with leading LTE TDD solutions."
The collaboration will utilize Huawei's expertise in LTE TDD network infrastructure technologies and Intel’s innovative and cost-optimized mobile communication platforms to expedite the maturity and deployment of LTE TDD. By connecting directly to the Huawei’s infrastructure Intel will carry out end-to -end testing of its mobile platforms in a real life environment.
"Collaborative innovation is Intel’s strategy in China," said W.K Tan, VP of Intel IAG & Head of MCG, China. "The engagement with Huawei will take advantage of the two companies’ strengths and leading technologies. We are committed to working together with partners in China to build a healthy LTE TDD ecosystem within China and even beyond."
Related News
- Intel to Collaborate with Microsoft on DARPA Program
- Sequans and Huawei Collaborate to Advance LTE Broadcast Technology
- TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
- Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing
- Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |