DMP Introduces High-End OpenGL ES 2.0 IP Cores and Multi-Core Configurations to Its SMAPH-S Product Family
Company also extends its low-end offering with the world’s smallest OpenGL ES 2.0 IP core: SMAPH-S Lite
Tokyo, Japan– May7, 2012 – Digital Media Professionals Inc. (DMP), a leading provider of 2D/3D graphics Intellectual Property (IP) cores, today ann1ounced significant product expansion to its scalable SMAPH-S shader based Graphics IP Core product family including:
- New high-end and OpenGL ES 2.0 compliant IP cores with multi core deployment (MP) support that offers the industry leading graphics rendering and computing performance.
- SMAPH-S Lite, the most cost effective graphics IP core that offers the smallest OpenGL ES 2.0 compliant silicon footprint in the industry.
All new SMAPH-S IP cores are ready for customers’ SoC deployments immediately.
DMP’s SMAPH-S OpenGL ES 2.0 product family offers the industry’s best scalability from low-end graphics cores to high-end. When SMAPH-S Lite is the smallest OpenGL ES 2.0 IP core in the world, the new high-end SMAPH-S variants and multicore configurations will provide the highest performance in the market, but also 2-4 times smaller die size and power consumption compared to competitive offerings today. This IP product offering has been achieved by DMP’s innovative and state-of-the-art SMAPH-S architecture design where it is easy to increase or decrease the number of shader processors and/or rendering pipelines to meet exact performance, die size, and power consumption requirements of the target platform. The highlights for new SMAPH-S high-end IP cores are:
- Number of shader processors (SP) is extended to 32 at each core.
- Number of rendering pipelines is extended to 4 at each core.
- Multi core configuration is supported up to 4MPs.
SMAPH-S Lite is a tiny 3D graphics IP core that offers industry lowest power consumption based on its innovative power saving technologies and highly optimized OpenGL ES 2.0 based shader pipelines. SMAPH-S Lite has been optimized to offer ultra-low power, good performance and low cost GPU solution to modern applications in a wide range of consumer devices starting from entry-level feature mobile phones, to other consumer devices such as printers and cameras.
“Our customers are demanding embedded graphics solutions that meet extremely low-cost, low-power requirements and can still deliver good performance and visually pleasing user interfaces in consumer devices. Same time mobile and tablet industry is looking for ultra-high resolutions to be supported in next generation mobile devices and this will require high-end and multicore graphics offering to fill this significantly increased pixel pipeline” said Tatsuo Yamamoto, CEO of DMP. “By scaling our SMAPH-S graphics cores to low and high ends we answer our customers’ needs and further strengthen our industry leadership to provide the most scalable graphics IP offering with the highest performance and the best power efficiency per square millimeter of silicon area.”
DMP will demonstrate new SMAPH-S IP core family at Japan’s embedded tradeshows “ESEC 2012,Tokyo” on May 9th –11th, and at “COMPUTEX TAIPEI 2012” on June 5th – 9th, the largest computer exhibition in Asia.
About DMP
Digital Media Professionals Inc. (DMP)(TOKYO:3652) develops industry leading 2D/3D graphics solutions to global consumer electronics, mobile, embedded and automotive markets. Company has been founded at Tokyo, Japan in 2002 and is currently developing several graphics IP cores based on the open Khronos™ Group standards and DMP’s cutting edge 3D graphics technology DMP Maestro Technology.
For more about DMP, please visit our website: http://www.dmprof.com/english/
|
DMP Inc. Hot IP
Related News
- DMP adds OpenGL ES 2.0 shader-based graphics IP to its new "SMAPH" graphics IP core family
- DMP SMAPH-S Products to Support OpenGL ES 3.0 API Standard
- ARM Mali GPUs Achieve Industry-Firsts With Khronos OpenGL ES 2.0 Conformance For 1080p and Multicore
- RMI Announces Next Generation Multi-Core Processor Architecture and Product Family Developed on 40nm Process with Frequencies Greater than 2.0 GHz
- Khronos Group Releases OpenVG 1.1 Lite to Bring High-Quality Vector Graphics to OpenGL ES 2.0-Compatible GPUs
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |