5V Library for Generic I/O and ESD Applications TSMC 12NM FFC/FFC+
MagnaChip and YMC Enter Into a Joint Development Agreement for MTP-IP Devices
SEOUL, South Korea, and CUPERTINO, Calif., May 29, 2012 -- MagnaChip Semiconductor Corporation ("MagnaChip Semiconductor") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it has signed a joint development agreement with Yield Microelectronics Corporation (YMC) to develop a family of 0.35um and 0.18um standard Multiple Times Programmable (MTP)-IP devices.
This MTP-IP joint development agreement covers several standard memory cell sizes well-suited for embedded applications such as Displays, PMIC and LED controllers. By adding YMC's leading-edge MTP-IP to MagnaChip's existing NVM (non-volatile memory) portfolio, MagnaChip can provide enhanced foundry services to its global customers who stand to benefit from a world class IC design that incorporates next generation, low current embedded NVM performance.
These devices require simple processing and minimal programmability and utilize mixed-signal and BCD/high voltage technologies. For these requirements, YMC's MTP-IP employing MagnaChip's advanced manufacturing processes can be the optimal and cost-effective NVM solution for analog trim, configuration settings, code storage, digital rights management, and secure identification management.
This MTP-IP solution provides high performance and reliability for the most stringent customer applications and covers a wide range of MTP memory densities as needed in the market. This joint development project is scheduled to begin immediately, with design completion by June 2012 and qualification by the end of the year.
Namkyu Park, Vice President of MagnaChip's Foundry Marketing commented, "We are very pleased to announce MagnaChip's joint-development MTP-IP agreement with YMC, a leading IP solutions provider and partner in Taiwan. Our focus is to continue to offer cost-effective, high-performance NVM solutions to meet the increasing application specific needs of our BCD and mixed-signal foundry customers."
About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.
About Yield Microelectronics Corporation
Yield Microelectronics Corporation (YMC), located in Taiwan's Chu-Pei city, is a specialized embedded logic multiple-time non-volatile memory (NVM) IP provider. YMC's innovative NVM MTP-IP products are licensed to design houses and semiconductor foundries, allowing them to integrate crucial non-volatile memory with analog and digital functionality on a single chip. YMC's NVM IP is characterized by its competitive cell and macro size, adopts logic-based architecture and features the scalability and ease of porting for different technologies and processes such as logic, high-voltage, mixed-mode, bipolar-CMOS-DMOS and many others. For more information, please visit www.ymc.com.tw.
|
Related News
- T-RAM and GLOBALFOUNDRIES Enter into Joint Development Agreement for Application of T-RAM's Thyristor-RAM Embedded Memory to Advanced Technology Nodes
- Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm
- UMC Board Resolves to Enter a Joint Venture Agreement for a 12" Fab in China
- MegaChips and Vidatronic execute Joint Development Agreement
- Spansion and UMC Announce Joint Technology Development and Licensing Agreement
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |