7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
Microsemi FPGAs and cSoCs Available for Extreme Temperature Environments
Programmable Devices Operate at 150 Degrees Celsius to 200 Degrees Celsius
ALISO VIEJO, Calif., June 14, 2012 -- Microsemi Corporation , a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced that its field programmable gate arrays (FPGAs) and SmartFusion® customizable system-on-chip (cSoC) solutions are now characterized at extreme operating temperatures ranging from 150 degrees Celsius to 200 degrees Celsius. The devices have already been deployed in down-hole drilling products, space systems, avionics equipment and other applications requiring high performance and the utmost reliability in extreme low and high temperature environments.
"Components that are capable of highly reliable operation in extreme hot and cold temperatures are essential for oil exploration applications, aerospace and defense equipment, and other products used in harsh operating environments," said Paul Ekas, vice president of marketing for Microsemi's SoC product group. "Our new extreme temperature solutions demonstrate our continued commitment to delivering consistently high quality solutions that address tough industry challenges."
The following Microsemi products are now available in extreme operating temperature ranges:
Product | Technology | Characteristic |
SmartFusion® (A2F) | Mixed Signal (Flash) | Reprogrammable |
Fusion (AFS) | Mixed Signal (Flash) | Reprogrammable |
ProASIC®3 (A3P) | Flash | Reprogrammable |
IGLOO (AGL) | Flash | Reprogrammable |
ProASICPLUS (APA) | Flash | Reprogrammable |
SX-A | Antifuse | One-time-programmable |
MX | Antifuse | One-time-programmable |
ACT1, 2, 3 | Antifuse | One-time-programmable |
For additional information, please contact a local Microsemi sales representative or visit www.microsemi.com/soc/extremetemp.
About Microsemi
Microsemi Corporation (MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense and security, aerospace, as well as industrial and medical markets. Products include mixed-signal integrated circuits, SoCs and ASICS; programmable logic solutions; power management products; timing and voice processing devices; RF solutions; discrete components; and Power-over-Ethernet ICs and midspans. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
|
Microsemi Hot IP
Related News
- Fusion Mixed Signal FPGAs Now Available In Extended Temperature Grade
- Microsemi RTG4 FPGAs Become Industry's First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification
- Microsemi PolarFire FPGAs Enable Smallest, Lowest Power DisplayPort Implementations with New IP from Bitec
- Microsemi's Mi-V Ecosystem Continues to Expand as New Member Antmicro Joins to Develop Mi-V RISC-V Processor Subsystems for PolarFire FPGAs
- Microsemi to Showcase Third-Party IP Offerings for Machine Vision Applications Using its Cost-Optimized, Low Power Mid-Range PolarFire FPGAs at Embedded World
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |