S3 Group and Amimon Collaborate on Latest Nesher Chipset
MONTREAL (International Microwave Symposium) – June 18th, 2012 - S3 group, a global independent service provider of IP and professional services to OEMs, system vendors and semiconductor companies, today announced that it completed all of the IC implementation for Amimon’s latest WHDI TX and WHDI RX Baseband ICs likely to be used for their next generation Wireless Video device. Amimon is a fabless semiconductor company pioneering wireless uncompressed high-definition video for universal connectivity among CE, PC, mobile and professional video devices.
Amimon’s Nesher chipset is their third generation baseband IC product. The key objectives of the project were to reduce the total system solution BoM, support new HDMI 1.4A features (3D formats, 2kx4k and audio return channel), optimize transmission power, increase the range of operation, support WiFi co-existence and uplink higher bandwidth and lower latency.
"Nesher is a complex chipset which proved to be technically challenging with a large amount of memory and IP integration. S3 Group was extremely professional throughout this project and treated the product as though it was their own. Through our strong collaboration with them, S3 Group was able to ensure that their implementation of our design will result in a best-in-class product for our customers.” said Dr. Moshe Meyassed, VP R&D, Amimon.
“Amimon’s Nesher chipset is the most advanced chipset for use in wireless uncompressed high-definition video. Throughout this project S3 Group brought to bear its significant expertise in implementing production quality SoCs. Our team was able to achieve a robust implementation while meeting very challenging power, area and performance objectives. We are proud to have been able to deliver the flexibility to the project that was needed and look forward to further collaborations with Amimon.” said Dermot Barry, VP Silicon, S3 Group.
About S3 Group:
S3 Group delivers IP and professional services to OEMs, system vendors and semiconductor companies. The company is the longest serving independent service provider in the industry, building a wealth of experience and engineering expertise over the last 25 years. In addition to design services the company has a comprehensive portfolio of RF and mixed-signal IP. The IP portfolio includes high performance ADC and DAC converters, PLLs, Analog Front Ends (AFEs), Power Management, RF Transceivers and other miscellaneous circuits which have been silicon proven at a number of silicon foundries (TSMC, GlobalFoundries, UMC, SMIC, IBM, Tower) at nodes ranging from 180nm to 40nm and below. Global end markets served by S3 Group clients include Wireless and Wireline Communications, Digital Broadcasting, Imaging, Solar, Green Energy and Industrial. Founded in 1986, S3 Group, headquartered in Dublin, Ireland, focuses on three business areas: Semiconductor, TV Technology and Telehealth, and has development centers in Ireland, Poland, the Czech Republic and Portugal with sales offices and representatives worldwide. For further information please visit www.s3group.com/silicon
About AMIMON
Wireless connectivity is changing the way consumers view high-definition content from mobile devices, at home and on the go. AMIMON, a market leader in wireless HD and universal mobile connectivity, is the only company in the world that is harnessing the power of mobile devices to bring their HD content to the TV screen. As a founding member of the WHDI (Wireless Home Digital Interface) standard, AMIMON’s semiconductor solutions utilize WHDI to give consumers convenience and flexibility to access and view content on devices from all manufacturers via the TV. AMIMON is headquartered in Herzlia, Israel, with offices in Santa Clara, Calif.; Tokyo, Japan; Taipei, Taiwan and Shenzhen, China. To connect with AMIMON, visit http://www.AMIMON.com and http://www.whdi.org.
|
Related News
- S3 Group Announces Latest Release to its RF and Mixed Signal IP Product Guide
- S3 Group and Siano Mobile Silicon Collaborate on Mobile TV Receiver Chips
- S3 Group Accelerates Latest Pace Mediaroom IPTV Set-Top Box Platform to Market
- S3 and Percello Collaborate to Produce Latest Femtocell Baseband Processor
- ESWIN Computing Pairs SiFive CPU, Imagination GPU and In House NPU in Latest RISC-V Edge Computing SoC
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |