Dresden fab could host 20-nm process, 450-mm wafers
Peter Clarke, EETimes
6/18/2012 11:42 AM EDT
DRESDEN, Germany – Fab 1, the 300-mm operation of GlobalFoundries Inc. here, could be used for 20-nm process technology and for processing 450-mm wafers, according to, Rutger Wijburg, vice president and Fab 1 general manager. Wijburg was speaking to a group of journalists being given a tour of the Dresden wafer fab on Friday, June 15.
Fab 1 is Europe's largest and most advanced wafer fab but it is about to get eclipsed in GlobalFoundries' portfolio by a wafer fab being brought online in Malta, New York, which will run 20-nm process technology on 300-mm wafers. Meanwhile Fab 1 is itself in the middle of a $3 billion upgrade that will take its manufacturing capacity to 80,000 300-mm wafer starts per month or 1 million wafer starts per year. That influx of equipment into a 12,000 square foot clean room known as the annex, was begun in mid-2011 is due to continue on an "as needed' basis until 2014.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Could 450-mm wafers play away from the leading edge?
- Weebit Nano receives wafers manufactured in GlobalFoundries' 22FDX® process
- TSMC expected to begin 20-nm line early
- Cadence and GLOBALFOUNDRIES Collaborate to Enable Custom/Analog and Digital Design of 20nm Manufacturing Process
- TU Dresden Realized 28nm Low Power Test Chip with Tensilica Processor and RacyICs Power Management in GLOBALFOUNDRIES Process
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity