7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
Dresden fab could host 20-nm process, 450-mm wafers
Peter Clarke, EETimes
6/18/2012 11:42 AM EDT
DRESDEN, Germany – Fab 1, the 300-mm operation of GlobalFoundries Inc. here, could be used for 20-nm process technology and for processing 450-mm wafers, according to, Rutger Wijburg, vice president and Fab 1 general manager. Wijburg was speaking to a group of journalists being given a tour of the Dresden wafer fab on Friday, June 15.
Fab 1 is Europe's largest and most advanced wafer fab but it is about to get eclipsed in GlobalFoundries' portfolio by a wafer fab being brought online in Malta, New York, which will run 20-nm process technology on 300-mm wafers. Meanwhile Fab 1 is itself in the middle of a $3 billion upgrade that will take its manufacturing capacity to 80,000 300-mm wafer starts per month or 1 million wafer starts per year. That influx of equipment into a 12,000 square foot clean room known as the annex, was begun in mid-2011 is due to continue on an "as needed' basis until 2014.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Could 450-mm wafers play away from the leading edge?
- Weebit Nano receives wafers manufactured in GlobalFoundries' 22FDX® process
- TSMC expected to begin 20-nm line early
- Cadence and GLOBALFOUNDRIES Collaborate to Enable Custom/Analog and Digital Design of 20nm Manufacturing Process
- TU Dresden Realized 28nm Low Power Test Chip with Tensilica Processor and RacyICs Power Management in GLOBALFOUNDRIES Process
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset