SMIC and Brite Semiconductor's 40LL Dual-core ARM Cortex-A9 Processor-based Test Chip Achieves 1.3GHz
SHANGHAI, June 20, 2012-- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), and Brite Semiconductor (Shanghai) Corporation, a leading IC design and turnkey service provider, today jointly announced that their dual-core ARM® Cortex™-A9 MPCore™ processor-based chip, adopting SMIC's 40nm LL (low-leakage) process technology, has achieved a clock rate of 1.3GHz in silicon tests.
The test chip incorporates a 32K I-Cache and a 32K D-Cache, memory compiler modules, ARM NEON™ technology, and ARM CoreSight™ debug and trace technology, as well as built-in SRAM, DMA, NOR flash, SDRAM, and VGA interfaces integrated through AMBA® AXI on the test chip. In addition to the high-speed standard cell library, the test chip also incorporates SMIC's customized high-speed memory and cell library for performance enhancement (SMIC Performance Enhancement Kit).
"Brite's rapid achievement demonstrates the stability of SMIC's 40nm LL process and our market leadership. Working closely with Brite and ARM allows us to provide our customers integrated platforms to accelerate time-to-market and mitigate the development risks of their advanced node designs. The milestone today once again demonstrates our dedication to provide industry-leading technology," said Chris Chi, Chief Business Officer of SMIC. "SMIC will continue to reinforce the development of our advanced technologies and provide highly competitive solutions for energy-efficient and high-performance consumer devices."
"ARM Cortex-A9 dual-core test chip performance has met our expectations, proving Brite Semiconductor has the solid technical foundation needed to meet industry demand. The next Cortex-A9 dual-core chip that will soon tape out will achieve higher performance. Brite Semiconductor is committed to providing our customers the most advanced platforms with integrated solutions. We believe that with the combined efforts of SMIC, ARM and our partners, we will surely achieve our goal to bring tremendous value to our customers," said Dr. Charlie Zhi, President and Chief Executive Officer of Brite Semiconductor.
"This milestone from the ongoing collaboration between Brite, SMIC and ARM is a great example of how collaboration drives innovation in the development of core technology for the next generation of smart, connected devices," said Allen Wu, President, ARM China. "We value our partnership with Brite and SMIC, and are committed to providing mutual customers with the most advanced design and production platforms, based on ARM technology, that meet their power, performance and time-to-market needs," said Allen Wu, President of ARM China.
About Brite Semiconductor
Brite Semiconductor is a world-leading ASIC design services company, providing customers with ULSI ASIC/SoC chip design and manufacturing services. Brite Semiconductor was co-founded by Semiconductor Manufacturing International Corporation and Open-Silicon, as well as venture capital firms from China and abroad. As the strategic partners, SMIC and Open-Silicon provide Brite Semiconductor with strong technical and manufacturing support. Targeted at 90nm/65nm/40nm and high-end SoC design services, Brite Semiconductor provides flexible turn-key service from RTL/netlist to chip delivery, and seamless, low-cost, and low-risk solutions to customers. For more information, please refer to the Brite Semiconductor website: www.britesemi.com.
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, and a 200mm fab under construction in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation.
For more information, please visit http://www.smics.com.
|
SMIC Hot IP
Related News
- SMIC and Brite Semiconductor's 40LL Dual-core ARM Cortex-A9 Processor-based Test Chip Achieves 1.3GHz
- SMIC and Brite Semiconductor Tape Out Low Leakage 40nm Test Chip Based on a Dual-Core ARM Cortex-A9 Processor
- Amlogic Unveils Market Leading Dual-Core ARM Cortex-A9 Processor-Based SoCs for Next-Generation Tablet, Set-Top-Box and Mobile Devices
- Cadence Encounter Technologies Enable Open-Silicon to Reach 2.2 GHz Performance on 28nm ARM Dual-Core Cortex-A9 Processor
- Open-Silicon Uses Synopsys IC Compiler to Achieve 1.3GHz Frequency on Quad-Core ARM Cortex-A9 MPCore Processor
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |