Radiation Hardened SRAM Designed by RedCat Devices and Fabricated in TowerJazz's 0.18um Process Flow Withstands 15 Mrad Total Ionization Dose
- Developed technology in TowerJazz commercial foundry opens multi-billion markets requiring specific components able to withstand high dose radiation
- Applications include electronics for communication, observation and navigation systems as well as production of sterilized medical devices
MIGDAL HAEMEK, Israel and MILAN, Italy, June 25, 2012 – RedCat Devices, a fabless company specializing in the development of radiation hard (rad-hard) components for civilian and special applications, and TowerJazz, the global specialty foundry leader, announced today a breakthrough achievement in the design and fabrication of radiation hard integrated circuits (ICs). The developed technology opens multi-billion markets that require specific components able to withstand high dose radiation. Such doses lead to errors and irreversible failures in standard CMOS products. The markets include electronics for communication, observation and navigation systems as well as new applications, such as production of medical devices sterilized with high doses of gamma radiation and further tracking of these devices.
As a part of the Program focused on the development of the radiation hard components, the companies for the first time report the results of testing RedCat’s 512 kbit SRAM (RC7C512RHH). The part has been designed by RedCat using its rad-hard standard cell library and IPs with the support of TowerJazz’s Design Center in Netania, Israel, and fabricated in TowerJazz’s Fab 2 in Migdal Haemek, Israel utilizing a flavor of its commercial 0.18-micron CMOS process flow. RC7C512RHH has been developed following several rad-hard by design techniques: from the architecture level down to the layout level. Edge-less transistors were used to avoid Total Ionization Dose (TID) damaging effects. Transient propagation and functional interrupts as well as single-event latch-ups were mitigated by patented design solutions. SRAM was supplied with radhard pad ring (ESD protection).
The experiments were performed at the X-ray facility in Legnaro (Padova), Italy in passive and active modes. No errors were observed for absorbed doses of above 15 Mrad (Si). All of the functional tests after irradiation passed without any failure. Radiation immunity of the demonstrated level was previously reported only for digital ICs fabricated in dedicated foundries specialized in rad-hard technologies. Therefore, this new design allows for radiation immunity on analog ICs fabricated using TowerJazz’s CMOS process.
“We are impressed by the design demonstrated by RedCat, which in combination with TowerJazz’s CMOS technology allowed us to achieve outstanding SRAM performance. By making rad-hard technology available in TowerJazz’s commercial foundry, it allows us to not only target the traditional aerospace applications, but also the growing multi-billion dollar markets of food processing, medical device sterilization, and environmental cleanup technologies,” said Dr. Avi Strum, TowerJazz VP and General Manager of Specialty Business Unit.
"We are excited about producing specialty rad-hard ICs in cooperation with TowerJazz,” said Dr. Cristiano Calligaro, CEO of RedCat Devices. “Many customers have already expressed their interest in the developed technology. We plan to expand and diversify our rad-hard product portfolio to include non-volatile memories and CMOS image sensors, and we are pleased that TowerJazz offers these specialty process technologies as well. Some of the products are already in the final stages of development.”
The companies wish to thank the Israeli Ministry of Industry and Trade and the Italian Ministry of Foreign Affairs for the financial support provided within the Israel-Italy Joint Innovation Program for Industrial, Scientific and Technological Cooperation in R&D.
About RedCat Devices
RedCat Devices (RCD) is a fabless semiconductor company developing volatile and non-volatile radiation immune memories for civilian and special applications, in particular for aerospace programs. RCD was established in 2006 using the funding provided by the Milan Chamber of Commerce and the Lombardia Region. RedCat’s radiation hard (rad-hard) libraries and IPs have been developed and verified together with the leading semiconductor foundries. This approach combines the most advanced standard CMOS processes with rad-hard by design. For more information, please, visit http://www.redcatdevices.it/.
About TowerJazz
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), its fully owned U.S. subsidiary Jazz Semiconductor Ltd., and its fully owned Japanese subsidiary TowerJazz Japan, Ltd., operate collectively under the brand name TowerJazz, the global specialty foundry leader. TowerJazz manufactures integrated circuits with geometries ranging from 1.0 to 0.13-micron, offering a broad range of customizable process technologies including: SiGe, BiCMOS, Mixed-Signal and RFCMOS, CMOS Image Sensor, Power Management (BCD), and Non-Volatile Memory (NVM) as well as CMOS and MEMS capabilities. TowerJazz also offers a world-class design enablement platform that complements its sophisticated technology and enables a quick and accurate design cycle. In addition, TowerJazz provides (TOPS) Technology Optimization Process Services to IDMs as well as fabless companies that need to expand capacity, or progress from an R&D line to a production line. To provide multi-fab sourcing, TowerJazz maintains two manufacturing facilities in Israel, one in the U.S., and one in Japan with additional capacity available in China through manufacturing partnerships. For more information, please visit www.towerjazz.com.
|
Related News
- eMemory's 2nd Generation NeoMTP Enables a Wide Range of Power Management Applications on DB HiTek's BCD Process
- TSMC's Extremely Low Leakage Devices on 180nm eLL process empowers Dolphin Integration's IP offering
- Dongbu HiTek and Kilopass Announce Availability of XPM Embedded NVM for Dongbu's 0.18um Process Node
- SMIC Adds New Design Kit for its 0.18um CMOS Process for Use with Agilent Technologies'EDA Software
- UMC and Virage Logic Announce Qualification of Embedded Non-Volatile Memory Technology on UMC's 0.18um Logic Process
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |