Gilles Delfassy joins Board of Sequans
PARIS — June 28, 2012 — 4G chipmaker Sequans Communications (NYSE: SQNS) announced today that Gilles Delfassy, wireless semiconductor industry veteran, has joined its board of directors.
Delfassy was most recently president and CEO of ST-Ericsson, a world-leading supplier of semiconductors to top-tier handset manufacturers, at the helm from 2009 to 2011. Previously, he spent 28 years of his career at Texas Instruments Inc. (TI) where he created and ran the Wireless business and served as senior vice president and executive officer of the company. Under his leadership at TI, the company developed the OMAP™ multimedia platform and became the world’s number one supplier of semiconductors to the wireless industry with its chips inside more than half of the world’s cellular phones. After he retired from TI in 2007 and before joining ST-Ericsson, Delfassy was an advisor to many high-tech companies and served on several corporate boards.
“Gilles’ tremendous knowledge of the global wireless and semiconductor markets is invaluable and will be of great benefit to Sequans, especially now as we gain traction in global LTE markets,” said Georges Karam, Sequans CEO. “We are very pleased to have him join our board.”
About Sequans Communications
Sequans Communications S.A. (NYSE: SQNS) is a 4G chipmaker, supplying LTE and WiMAX chips to original equipment manufacturers and original design manufacturers worldwide. Founded in 2003 to address the WiMAX market, the company expanded in early 2009 to address the LTE market. Sequans is based in Paris, France with additional offices throughout the world, including United States, United Kingdom, Israel, Hong Kong, Singapore, Taiwan, South Korea, and China. www.sequans.com
|
Related News
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |