New SystemC Library Now Available from Accellera Systems Initiative
Proof-of-Concept Library is compatible with IEEE Std. 1666™-2011 Standard, includes Transaction-Level Modeling
Napa, Calif., USA, 16 July 2012 — Accellera Systems Initiative announces the release of version 2.3.0 of its SystemC open source proof-of-concept library, now available at no charge to the worldwide electronic design community. Compatible with the newly revised IEEE 1666 "Standard SystemC Language Reference Manual," announced by the IEEE Standards Association in November 2011, version 2.3.0 provides a number of important new features, including support for transaction-level modeling (TLM), a critical approach to enable high level and more efficient design of complex ICs and SoCs in a single library.
New extensive process control features enable modeling of concepts such as power domains and abstract schedulers. A new first-class events list and a new container for SystemC objects simplify the description of generic and scalable models. In addition, an improved simulation API and a new thread safety mechanism will allow much better interaction with external tools and support for multi-threading.
Documentation has been reorganized for clarity, and there is a new document highlighting the features added for compatibility with the latest version of the SystemC standard. The library, installation notes and readme files have been updated to support installation on the latest operating systems and compilers. To ensure a high quality release, the library has been reviewed and tested by members of the SystemC Language Working Group, and feedback from the recently completed public review has been incorporated in the release.
“Accellera Systems Initiative encourages SystemC users and tool suppliers everywhere to move to the new IEEE 1666 standard,” said David Black, chair of the SystemC Language Working Group. “I would like to recognize the members of the SystemC Language Working Group, which is composed of system and semiconductor engineers, vendors and educators worldwide. We appreciate their contribution to the electronic design community and their diligent work in making this new library possible.”
The standard may be obtained at no charge via the Accellera Systems Initiative-sponsored GET IEEE program by visiting http://www.accellera.org/downloads/ieee/. The newly released version 2.3.0 of the open source proof-of-concept library (and the corresponding regression suite) may be downloaded by visiting http://www.accellera.org/downloads/standards.
About Accellera Systems Initiative
Accellera Systems Initiative is an independent, not-for profit organization dedicated to create, support, promote and advance system-level design, modeling and verification standards for use by the worldwide electronics industry. The organization accelerates standards development, and as part of its ongoing partnership with the IEEE, its standards are contributed to the IEEE Standards Association for formal standardization and ongoing change control. For more information, please visit www.accellera.org.
|
Related News
- Accellera Systems Initiative Announces IEEE 1666 SystemC Language Standard for Electronic System-Level Design Is Available for Download at No Charge
- Accellera Systems Initiative advances the SystemC ecosystem with a new core language library
- Accellera Announces IEEE 1666™-2023 Standard Available Through IEEE GET Program
- IEEE Releases the Accellera SystemC AMS Standard as IEEE 1666.1-2016
- Accellera Systems Initiative Delivers UVM 1.2 to IEEE for Standardization
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
E-mail This Article | Printer-Friendly Page |