Inband Software Offers DSP Development Services for Tensilica Customers
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
Inband Expertise Includes Audio and Voice Codecs, Image Processing and Digital Communications
SANTA CLARA, Calif. USA - August 7, 2012 -Tensilica, Inc. today announced that Inband Software has worked closely with Tensilica on several HiFi Audio/Voice DSP (digital signal processor) porting projects and is now an Authorized Software Partner in the Xtensions Network.
Inband Software can assist in algorithm development, fixed-point conversion, and optimization for Tensilica's HiFi Audio/Voice DSPs and other architectures. Inband Software has experience in a variety of DSP applications including audio and voice codecs, image processing, and digital communications and the company collaborated with Tensilica in the development of several speech codecs, such as G.711, G.726 and G.722, as well as various packet loss concealment modules.
"We have been very impressed with the technical skills, capabilities, and speech codec standards experience of the Inband Software team," stated Larry Przywara, Tensilica's senior director of Mobile Multimedia. "They know how to efficiently optimize software to run on our Xtensa and HiFi architectures and deliver a product that meets our exacting requirements for standards compliance, robustness, and conformance to our coding and interface specs."
"Tensilica's tools are first class and let us quickly find performance hot spots so we can focus our efforts in the areas that offer the biggest improvement," stated Juan Carlos Rojas, PhD, Inband Software's CEO. "We were most impressed with the high level of productivity and optimal performance we could get from the Tensilica solution while remaining completely in C code. We didn't need any assembly-level programming to get optimal efficiency."
Tensilica's HiFi Audio DSPs are the leading licensable audio DSP IP cores, licensed by almost 50 customers including many of the top 10 semiconductor manufacturers and leading system OEMs. The HiFi Audio DSPs support over 100 audio/voice codecs and audio/voice pre and post-processing applications with cores that can target from leading performance to ultra-low power power. The HiFi Audio DSPs are part of Tensilica's growing line of dataplane processors (DPUs) that efficiently do the challenging, compute and signal processing intensive tasks in system-on-chip (SOC) designs.
About Inband Software
Inband Software is experienced in a variety of DSP applications including audio and video codecs, image processing, and digital communications. Inband Software can assist in algorithm development, fixed-point conversion, and optimization for many architectures. For more information, visit www.inbandsoft.com.
About Tensilica
Tensilica, Inc. is the leader in customizable dataplane processor IP cores with almost 200 core licensees. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10 to 100x the performance because they can be customized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- IntegrIT Joins Tensilica's Xtensions Partner Network for DSP Software Services
- Tensilica Offers Free Diamond Core Software Development and Modeling Tools
- Tensilica Offers Xtensa Software Development Tools on Linux Platform
- TI offers video extensions, software for rapid DSP development
- Quadric's DevStudio Speeds Software Development with Industry's First Integrated ML + DSP Cloud-Based Code Development Platform
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |