UMC to shutter Japanese fab
Dylan McGrath, EETimes
8/22/2012 2:06 PM EDT
SAN FRANCISCO—Taiwanese foundry United Microelectronics Corp. (UMC) said Tuesday (Aug. 21) its board of directors voted to close the company's 200-mm fab in Japan in an effort to cut costs amid difficult macroeconomic conditions and customer demand decline.
E-mail This Article | Printer-Friendly Page |
|
Related News
- UMC announces new 22nm wafer fab in Singapore
- Attopsemi's I-fuse OTP IP Now Qualified on a Japanese Wafer Fab's 130nm BCD and Embedded into ABLIC's IC Product
- UMC Board Resolves to Enter a Joint Venture Agreement for a 12" Fab in China
- NJR Analog ICs Manufactured at UMC Adopted by Major Japanese Auto OEM
- UMC Obtains LEED Gold Certification for Fab 12A P3 & P4
Breaking News
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition